LED Circuit Structures with Connecting Sections for Manufacturing
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Solution Overview
Problem
The existing methods for manufacturing light emitting diodes (LEDs) are inefficient due to the time-consuming process of etching metal electrodes and forming electrical connections, resulting in a low yield rate.
Innovation Solution
A method involving the formation of circuit structures on a substrate with aligned concaves and through holes, followed by cutting to create insulated electrical connecting portions, fixing LED chips, and encapsulating them, which simplifies the manufacturing process and increases yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal electrodes are etched to insulate from each other and holes are filled with conductive materials to electrically connect electrodes, then electrical connections are achieved, but the manufacturing process becomes time-consuming and yield rate decreases
Solution Approach 1:
The patent applies preliminary action by pre-forming isolated conductive portions directly on the substrate before mounting LED chips. The circuit board includes conductive portions (51, 52, 53, 54) that are pre-positioned and insulated from each other, eliminating the need for time-consuming etching and hole-filling operations during final assembly. This advance preparation of electrical connection structures significantly reduces manufacturing time while ensuring reliable electrical connections.
Solution Approach 2:
The patent applies segmentation by dividing the conductive structures into separate, isolated portions (51, 52, 53, 54) that are physically separated and insulated from each other on the substrate. This segmentation allows each conductive portion to be independently formed and positioned, ensuring proper electrical isolation while simplifying the overall manufacturing process compared to traditional etching methods.
2Ease of manufacture
If traditional LED wafer division process is used with substrate electrodes, then LED chips can be mounted, but the process complexity increases and production time is extended
Solution Approach 1:
The patent applies preliminary action by pre-forming isolated conductive portions directly on the substrate before mounting LED chips. The circuit board includes conductive portions (51, 52, 53, 54) that are pre-positioned and insulated from each other, eliminating the need for time-consuming etching and hole-filling operations during final assembly. This advance preparation of electrical connection structures significantly reduces manufacturing time while ensuring reliable electrical connections.
3Reliability
If multiple processing steps are performed for electrical connection formation, then reliable electrical connections are achieved, but the number of manufacturing steps increases
Solution Approach 1:
The patent applies merging by combining multiple traditional manufacturing steps into a single integrated process. The isolated conductive portions (51, 52, 53, 54) are formed directly on the substrate in one operation, combining what would traditionally require separate etching, insulation, and conductive material deposition steps. This consolidation reduces process complexity while maintaining reliable electrical connections through the pre-formed insulated conductive structures.
Data Source
AI summary
A method for manufacturing LEDs includes following steps: forming circuit structures on a substrate, each circuit structure having a first metal layer and a second metal layer formed on opposite surfaces of the substrate and a connecting section interconnecting the first and second metal layers; cutting through each circuit structure along a middle of the connecting section to form first and second electrical connecting portions insulated from each other via a gap therebetween; arranging LED chips on the substrate and electrically connecting the LED chips to the first and second electrical connecting portions; forming an encapsulation on the substrate to cover the LED chips; and cutting through the substrate and the encapsulation between the first and second electrical connecting portions of neighboring circuit structures to obtain the LEDs.