LED Module Clad Member Adhesion Reliability
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Solution Overview
Problem
The existing LED modules face issues with the encapsulating resin and gold-plated metal electrodes not being strongly bonded, leading to thermal deformation and potential exfoliation during the installation process, which can result in the LED chips not turning on.
Innovation Solution
The introduction of a clad member between the metal wiring and the encapsulating resin, made of a material with enhanced adhesion strength, helps to improve the bonding between the resin and the metal wiring, preventing exfoliation and enhancing the reliability of the LED module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold-plated layers are formed on metal electrodes to increase conductivity, then electrical conductivity is improved, but bonding strength between encapsulating resin and metal electrodes deteriorates
Solution Approach 1:
A clad member made of aluminum or aluminum alloy is introduced as an intermediary layer between the gold-plated metal electrode and the encapsulating resin. This mediator provides a bonding interface that is compatible with both the conductive gold layer and the resin, preventing direct contact between incompatible materials and eliminating exfoliation risk during thermal processing.
Solution Approach 2:
The metal electrode structure is constructed as a composite with multiple layers: a base metal layer for structural integrity, a gold-plated layer for electrical conductivity, and an aluminum clad layer for resin bonding compatibility. This composite structure combines the advantages of different materials while mitigating their individual disadvantages.
2Reliability
If heating process is performed during installation to join LED module to circuit board, then electrical connection is improved, but thermal deformation and exfoliation of encapsulating resin occur
Solution Approach 1:
The aluminum clad member is pre-installed on the metal electrode before the encapsulating resin is applied. This preparatory measure creates a stable bonding interface that can withstand subsequent thermal stress during the heating process, cushioning against potential exfoliation and maintaining structural integrity throughout installation and operation.
3Reliability
If encapsulating resin covers metal electrodes to protect LED chip and wire, then protection function is improved, but adhesion between resin and metal electrode is insufficient
Solution Approach 1:
The aluminum clad member serves as a mediator that enables strong adhesion between the encapsulating resin and the metal electrode. The aluminum surface provides chemical and mechanical bonding sites that are compatible with the resin, ensuring the protection function is maintained without adhesion failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures strong adhesion between the clad member and both the metal wiring and the encapsulating resin, reducing the risk of exfoliation and improving the reliability and light emission efficiency of the LED module.
Implementation Method 1
made of a material with enhanced adhesion strength, helps to improve the bonding between the resin and the metal wiring
Data Source
AI summary
A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.