LED Chip Cluster Layout for Lens Area and Projection Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED lights with individually encapsulated LED chips in separate lamp beads do not fully utilize the lens area, leading to limitations in luminous efficacy and long-distance performance, making it challenging to optimize lighting performance.
Innovation Solution
An LED light-emitting structure with chip clusters containing multiple types of LED chips arranged in arrays and covered by optical elements, where the chips within and between clusters are configured to provide light compensation and enhance reflection, utilizing the optical elements' total reflection area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If individual LED chips are independently encapsulated within separate lamp beads, then each chip can be independently controlled and replaced, but the lens area is not fully utilized, resulting in limited luminous efficacy and long-distance performance
Solution Approach 1:
The patent merges multiple LED chips into a single lamp bead encapsulation unit, forming chip clusters with 2-9 chips per cluster. This combining approach fully utilizes the lens area within each lamp bead, increasing the effective light-emitting surface area and improving luminous efficacy while maintaining independent replaceability of the entire cluster
Solution Approach 2:
The patent transitions from one-dimensional single-chip arrangement to two-dimensional chip cluster arrays, with chips arranged in specific patterns (e.g., 2x2, 3x3 grids or radial patterns) within each lamp bead. This dimensional change maximizes space utilization of the lens area and enhances light distribution uniformity
2Device complexity
If individual LED chips are independently encapsulated within separate lamp beads, then the structure is simple and easy to manufacture, but the long-distance light projection and light distribution uniformity are limited
Solution Approach 1:
The patent segments the LED lighting system into modular lamp beads, each containing a chip cluster. This segmentation maintains structural simplicity and ease of assembly while the internal chip cluster arrangement within each module achieves enhanced light projection and uniformity
Solution Approach 2:
The patent employs asymmetric chip arrangements within clusters (e.g., staggered patterns, radial configurations from center to periphery) and varies the number of chips in different clusters (2-9 chips) to optimize light distribution patterns for long-distance projection and uniformity
3Productivity
If multiple LED chips are arranged in chip clusters with optical elements, then the lens area utilization and luminous efficacy are improved, but the arrangement complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies different chip arrangements and optical element configurations to different lamp bead positions (e.g., center vs. periphery, different heights) to optimize local light distribution characteristics, achieving overall uniformity while maintaining manageable complexity through localized design variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves long-distance projection and uniformity of light emission, optimizing lighting performance by enhancing the luminous efficacy and stability of LED lights.
Implementation Method 1
the principle of total internal reflection plays a crucial role in determining the luminous efficacy, where a larger reflection area leads to better long-distance light projection and more uniform light distribution
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An LED light-emitting structure, a light-emitting device and a preparation method for light-emitting structure. The LED light-emitting structure comprises: a base, a conductive portion is arranged on one side of the base; a chip cluster, the chip cluster comprises a plurality of LED chips, the plurality of LED chips comprise at least two types and are fixedly arranged on another side of the base and connected to the conductive portion; a plurality of the chip clusters are arranged on the base, and the positions of the LED chips in adjacent chip clusters correspond to each other; an optical element, the optical element is arranged to cover a side of the base corresponding to the chip cluster. The chip cluster is arranged on the base and includes a plurality of LED chips with different types, while the optical element is arranged to cover the chip cluster, therefore, during use, different LED chips within the chip clusters can work together to provide light compensation, increasing a total reflection area of the optical elements, enhancing long-distance projection while improving the uniformity and stability of luminous efficacy, thereby optimizing the lighting performance of lights utilizing the LED light-emitting structure.