LEDs with Integrated CMOS via Through-Silicon Vias
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Solution Overview
Problem
Conventional color displays using red, green, and blue LEDs are complex, costly, and not conducive to high resolution and compactness, particularly in portable and VR/AR applications, due to the need for different materials and substrates for color LEDs and CMOS circuit components.
Innovation Solution
Integration of LEDs with CMOS circuitry on the same substrate, utilizing through-silicon via (TSV) contacts to connect LEDs and CMOS components, enabling the formation of high brightness and high resolution color displays with integrated CMOS components on a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional color displays use separate substrates for LEDs and CMOS circuit components, then manufacturing is simpler, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the LED layer and CMOS circuit layer onto a single substrate by forming CMOS circuits on the back surface of the substrate while LEDs are formed on the front surface. This integration eliminates the need for separate substrates and inter-substrate connections, reducing overall device complexity while maintaining manufacturing feasibility through standardized semiconductor processing techniques.
Solution Approach 2:
The patent utilizes the third dimension (depth/thickness) of the substrate by forming CMOS circuits on the back surface while LEDs remain on the front surface. This vertical stacking approach allows both components to coexist on the same substrate without lateral interference, resolving the contradiction between manufacturing simplicity and device complexity.
2Ease of manufacture
If conventional color displays use different materials for different color LEDs, then color performance is achieved, but manufacturing cost increases
Solution Approach 1:
The patent employs a universal blue LED chip design that can be paired with different phosphor materials (yellow, red, green phosphors) to generate different color outputs. This multi-functional approach allows a single LED chip structure to serve multiple color display functions, significantly reducing manufacturing cost while maintaining full color display capability through phosphor conversion rather than requiring separate material systems for each color.
3Ease of manufacture
If conventional displays have LEDs formed on a different substrate than CMOS components, then component fabrication is easier, but display resolution and compactness deteriorate
Solution Approach 1:
The patent combines the LED and CMOS circuit components on a single substrate, enabling precise alignment and integration at the micrometer scale. This merger allows the display to achieve high resolution by ensuring accurate correspondence between LED pixel locations and CMOS circuit features, while the integrated structure naturally improves compactness by eliminating the need for separate substrate assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enables compact, high-resolution color displays suitable for portable and VR/AR devices by integrating LEDs and CMOS components on a single substrate, improving display efficiency and compactness.
Implementation Method 1
Light emitting diodes (LEDs) are widely used for various color display technologies
Implementation Method 2
The three primary colors are red, green and blue. However, conventional color displays using red, green and blue LEDs are complex
Implementation Method 3
conventional color displays employing different materials or components for different color LEDs, including color phosphors
Data Source
AI summary
Disclosed is a device which includes first and second major substrate surfaces. The first substrate surface includes an LED with first and second terminals while the second substrate surface includes CMOS circuit components. The CMOS components and LED are coupled by through silicon via (TSV) contacts which extend through the second substrate surface.