LED Package Light-Altering Coatings for Lead Frame Discoloration
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Solution Overview
Problem
Existing LED packages face challenges in achieving high light emission efficiency due to internal reflection and potential discoloration of lead frame structures, which can lead to reduced light output and non-uniformity of light emissions.
Innovation Solution
The use of light-altering coatings that cover portions of lead frame structures within package recesses, configured to reflect light emissions from LED chips and reduce the negative impacts of lead frame discoloration, while also being arranged in contact with or spaced relationship to the LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light-altering coatings are applied to lead frame structures, then light extraction efficiency is improved, but device complexity increases
Solution Approach 1:
A light-altering coating is introduced as an intermediary layer between the LED chip and the lead frame structure. This coating serves as a mediator that reflects light emissions back toward the emission direction, improving light extraction efficiency without requiring fundamental changes to the LED chip or lead frame design.
Solution Approach 2:
The light-altering function is extracted from the lead frame structure itself and applied as a separate coating layer. This allows the lead frame to maintain its original structural function while the coating provides the optical enhancement, reducing the complexity increase compared to redesigning the entire assembly.
2Stability of the object's composition
If light-altering coatings cover lead frame structures, then uniformity of light emissions is improved, but manufacturing complexity increases
Solution Approach 1:
The light-altering coating is applied specifically to the lead frame structure portions that are in proximity to the LED chip and capable of reflecting light emissions. This localized application ensures uniform light emission characteristics while minimizing the area requiring coating, thereby reducing manufacturing complexity compared to coating entire components.
3Productivity
If light-altering coatings are arranged in contact with LED chips, then light emission efficiency is maximized, but reliability decreases due to potential contamination
Solution Approach 1:
The light-altering coating acts as an intermediary protective layer between the LED chip and the lead frame structure. When arranged in contact with the LED chip, it maximizes light emission efficiency by reflecting light back toward the emission direction while simultaneously protecting the chip from potential contamination by lead frame discoloration or degradation products.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances light extraction and external quantum efficiency by reducing internal reflection and maintaining high light emission efficiency even when lead frame discoloration occurs, while also improving the uniformity of light emissions.
Implementation Method 1
such light-altering coatings may be configured to reflect light emissions from LED chips before such light emissions reach portions of lead frame structures
Implementation Method 2
Light extraction and external quantum efficiency of an LED can be limited by a number of factors, including internal reflection
Data Source
AI summary
Light-emitting diode (LED) packages, and more particularly arrangements of light-altering coatings in LED packages are disclosed. Exemplary LED packages may include lead frame structures that are at least partially encased by a housing. Arrangements of light-altering coatings may be provided that cover one or more portions of lead frame structures exposed within LED package recesses. By providing light-altering coatings that cover lead frame structures within package recesses, negative impacts from potential lead frame discoloration due to environmental exposure may be reduced. Additionally, such light-altering coatings may be configured to reflect light emissions from LED chips before reaching portions of lead frame structures. Light-altering coating arrangements are disclosed where light-altering coatings are arranged in contact with LED chips or, alternatively, in a spaced relationship with LED chips. Retention structures are disclosed that may define boundaries of light-altering coatings along recess floors of corresponding LED packages.