LED Color-Converting Substrate Hermetic Sealing
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Solution Overview
Problem
Current methods for fabricating color conversion substrates for LEDs are costly and fail to provide a hermetic seal for quantum dots, exposing them to the external environment, which affects their lifespan and performance.
Innovation Solution
A color conversion substrate is created using a first and second glass substrate with glass frit sealants, where the second sealant has a lower softening point and higher infrared laser light absorption than the first, allowing for a hermetic seal through laser sealing, eliminating the need for multilayer coating and etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple barrier layers are applied to protect quantum dots, then protection from moisture is improved, but fabrication cost increases
Solution Approach 1:
The patent merges the protection function and sealing function into a single integrated glass substrate structure with a recess. Instead of applying multiple separate barrier layers, the quantum dot is placed in a recess formed directly in the glass substrate, which provides both mechanical protection and moisture barrier functionality in one component, thereby reducing fabrication cost while maintaining protection effectiveness.
2Reliability
If glass surface is etched to accommodate quantum dots, then quantum dot protection is improved, but fabrication cost increases
Solution Approach 1:
The patent applies preliminary action by forming the recess in the glass substrate before placing the quantum dot. The recess is pre-formed to the appropriate depth and dimensions, allowing the quantum dot to be simply placed into the prepared cavity. This eliminates the need for costly post-placement etching processes while ensuring proper accommodation and protection of the quantum dot.
3Volume of moving object
If thin glass plate is used, then device compactness is improved, but sealing difficulty increases
Solution Approach 1:
The patent applies local quality by creating a recess only in the specific region where the quantum dot needs to be accommodated, rather than thinning the entire glass plate. The glass substrate maintains its original thickness in most areas for structural integrity and ease of sealing, while locally providing a recessed area for quantum dot placement. This allows use of thin glass plates for compactness without compromising sealing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication costs, protects quantum dots from external environments, and prevents thermal shock-induced cracks, enhancing the lifespan and performance of LED packages.
Implementation Method 1
the second sealant is formed of a material, the ability to absorb infrared (IR) laser light of which is greater than that of the first sealant
Implementation Method 2
laser-sealing the first substrate, the first sealant, the second sealant, and the second substrate to each other by irradiating the second sealant with a laser beam
Implementation Method 3
The softening point of the glass frit of the first sealant may be lower than the softening point of the first substrate. The softening point of the glass frit of the second sealant may be lower than the softening point of the glass frit of the first sealant
Data Source
AI summary
The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing same, the color-conversion substrate of a light-emitting diode comprising: a first substrate arranged on a light-emitting diode; a second substrate disposed facing the first substrate; a first sealing material disposed on the upper surface of the first substrate so as to section a grooved accommodating space having the first substrate as the bottom surface thereof; QDs filling the accommodating space; and a second sealing material, disposed between the second substrate and the first sealing material, having a shape corresponding to the first sealing material, wherein the second sealing material is made of material having a comparatively higher laser absorption rate in the infrared region than that of the first sealing material.