LED Lighting Assembly With Compliant Power Contacts

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing LED lighting systems face challenges in efficient thermal dissipation and cost-effective assembly due to the arrangement of power leads on the bottom and sides of LED packages, making it difficult to connect power leads to power conductors, especially as LED packages shrink in size and integrate multiple LED chips.

Innovation Solution

A lighting assembly with power contacts having compliant beams that deflect to bias against power leads on the top of the mounting substrate, and a dielectric housing that secures to a base independent of the LED package, allowing for efficient power supply and thermal dissipation by positioning the thermal interface along the bottom and sides of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If power leads are arranged on the bottom and sides of the LED package substrate, then thermal dissipation can be improved by positioning the thermal interface along the bottom and sides, but connecting power leads to power conductors becomes difficult and time-consuming

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoidassembly time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The patent inverts the conventional arrangement by placing power leads on the top surface of the substrate instead of the bottom or sides. This allows the thermal interface to be positioned along the bottom and sides for efficient heat dissipation, while power leads remain accessible on the top surface for automated connections to power conductors through the connector assembly.

Inventive Principle:

Principle #13The other way round (Inversion)

2Volume of moving object

If LED packages are made smaller to reduce size, then space efficiency is improved, but connecting power leads to power conductors becomes more difficult and automation becomes harder

Engineering Contradiction:

ImproveLED package sizeVSAvoidconnection ease

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent transitions the power lead connection from a planar arrangement to a three-dimensional configuration by using a connector assembly that extends vertically. The power contacts are arranged in a grid pattern on the top surface, allowing connections to be made in multiple dimensions and facilitating automated manufacturing processes even as package size decreases.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connector assembly serves as an intermediary component that bridges the power leads on the substrate and the power conductors. This separate connector module simplifies the connection process by providing a standardized interface, making assembly easier and more automatable regardless of the shrinking LED package size.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If multiple LED chips are integrated into a single package, then functionality is improved, but the number of power leads increases making soldering very difficult and uneconomical

Engineering Contradiction:

Improvefunctional integrationVSAvoidpower lead termination ease

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple power lead connections into a single connector assembly that interfaces with multiple power conductors simultaneously. The power contacts are arranged in a grid pattern where multiple contacts can be connected to multiple conductors in one assembly operation, eliminating the need for individual soldering of each power lead and making multi-LED chip packages economically manufacturable.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient power supply and thermal dissipation for LED packages with power leads on the top, facilitating easier assembly and reducing manufacturing costs by allowing for automation and improved connectivity.

Implementation Method 1

the power contacts having compliant beams extending to the separable interfaces, the compliant beams being deflected when contacting the power leads such that the power contacts are biased against the power leads

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentEP2333407B1LED Lighting assemblies

Publication Date: 2013.10.30 TE CONNECTIVITY CORP

Figure 1~2
Figure 3~4
Figure 5~6

AI summary

A lighting assembly (104) for a light emitting diode (LED) package (114) having an LED chip on the top of a mounting substrate with power leads on the top of the mounting substrate arranged proximate to a first edge of the mounting substrate, which is mounted to a base (112), includes power contacts defining separable interfaces for contacting the power leads on the mating substrate of the LED package (114) and supplying power to the LED chip. The power contacts have compliant beams extending to the separable interfaces that are deflected when contacting the power leads such that the power contacts are biased against the power leads. The power contacts are terminated to corresponding power conductors opposite the separable interfaces. The lighting assembly (104) also includes a dielectric housing holding the power contacts, with the housing having mounting features for securing the housing to the base (112) independent of the LED package (114).