LED Package Composite Particles Prevent Wavelength Conversion Subsidence
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In light-emitting diode package structures, wavelength conversion powder particles tend to subside due to gravitational force, resulting in concentration gradients and inconsistent color temperature, which complicates precise control of the light-emitting diode package's color output.
Innovation Solution
The use of composite particles formed by bonding wavelength conversion powder particles with shell-like second powder particles, which have a lower equivalent density, to prevent subsidence within the matrix material, ensuring uniform distribution and consistent light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wavelength conversion powder particles are used in the package material, then wavelength conversion function is achieved, but powder particles subside due to gravitational force causing concentration gradient
Solution Approach 1:
The patent uses composite particles consisting of wavelength conversion powder particles bonded with shell-like second powder particles. This composite structure combines materials with different densities to create particles that have reduced overall density and improved suspension stability in the package material, preventing subsidence while maintaining wavelength conversion functionality.
Solution Approach 2:
The patent changes the density parameter of the powder particles by bonding them with shell-like particles of lower density. This parameter modification allows the composite particles to achieve better distribution uniformity in the package material without subsiding under gravitational force.
2Reliability
If powder particles are used for wavelength conversion, then color conversion is achieved, but color temperature control precision deteriorates due to subsidence
Solution Approach 1:
By creating composite particles with shell-like structures, the patent achieves uniform distribution of wavelength conversion material throughout the package material. This uniform distribution ensures consistent color temperature across the LED package, improving manufacturing precision for color temperature control.
3Ease of manufacture
If simple powder particles are used, then easy processing is achieved, but subsidence occurs due to density difference with matrix material
Solution Approach 1:
The patent creates composite particles by bonding wavelength conversion powder with shell-like particles. This composite approach maintains ease of manufacture through simple mixing and bonding processes while effectively preventing subsidence through the density-balancing shell structure.
Solution Approach 2:
The patent modifies the density parameter of the wavelength conversion particles by combining them with lower-density shell materials. This parameter change enables the particles to match the density of the matrix material more closely, preventing subsidence while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the light-emitting diode package structure achieves consistent light colors and improved light extraction efficiency by uniformly distributing the wavelength conversion material, reducing the occurrence of subsidence and concentration gradients.
Implementation Method 1
the wavelength conversion material of the powder particles is subsided in the colloid material due to gravitational force
Implementation Method 2
Each second powder particle has a shell-like structure... prevent subsidence within the matrix material
Implementation Method 3
Each first powder particle is a wavelength conversion material... the wavelength conversion material used in the light-emitting diode package structure
Data Source
AI summary
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.


