Concave-Convex Electrode Structure for LED Chip Alignment

The patent applies preliminary action by pre-forming concave portions on the package body electrodes and convex portions on the light emitting chip bottom surface before the bonding process. These pre-formed geometric features guide the chip-electrode alignment during bonding, preventing misalignment and twisting that would otherwise occur during the attachment process. This preliminary structural preparation ensures reliable bonding without requiring complex real-time alignment control.

The patent applies asymmetry by introducing non-planar geometric features (concave portions on electrodes and corresponding convex portions on the chip) to the otherwise symmetric flat bonding interface. This asymmetric structural design creates a unique fit between the chip and electrode, providing mechanical guidance that prevents rotation and misalignment during bonding, thereby significantly improving positioning precision.

The patent applies the nesting principle by creating a hierarchical geometric interlocking structure where the convex portion on the chip fits into the concave portion on the electrode, forming a nested configuration. This nested geometric relationship provides mechanical constraint that prevents twisting during and after bonding, enhancing device reliability while maintaining a relatively simple bonding process.