Light Emitting Device with Concave Cup and Reflective Plate
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Solution Overview
Problem
Existing light-emitting diodes in backlight modules suffer from uneven brightness due to the optical effects of fluorescent materials, which cause increased light intensity in the central area and loss of original light distribution, leading to non-uniform lighting.
Innovation Solution
A light-emitting device design featuring a circuit substrate with a concave cup-shaped wall and a plate, where the wall and plate have light transmission and reflection properties, with specific height ratios and thicknesses optimized to enhance luminous efficiency and uniformity, including a light-emitting diode chip and fluorescent resin to adjust light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If fluorescent resin is used to convert blue light to white light, then light conversion efficiency is improved, but light distribution uniformity deteriorates due to increased central area intensity
Solution Approach 1:
The patent introduces a light diffusing layer with specific optical properties positioned between the fluorescent resin and the backlight panel. This layer has locally varied optical characteristics that scatter and redistribute light rays, creating uniform light distribution across the display panel while preserving the efficient blue-to-white light conversion in the fluorescent resin layer.
Solution Approach 2:
A light diffusing layer is introduced as an intermediary component between the fluorescent resin and the backlight panel. This intermediate layer mediates the light transmission process by scattering and redistributing the converted white light, preventing direct transmission of concentrated light from the LED chip while maintaining overall light efficiency.
2Illumination intensity
If wall height H2 and plate thickness H3 are increased to improve light distribution, then manufacturing complexity increases due to precise ratio requirements
Solution Approach 1:
The patent establishes specific mathematical relationships between critical dimensions (H3=A*(H2/H1)+B where A ranges from 10.5-15.5 and B ranges from 0.05-131.5) that define the optimal configuration of the light guide plate thickness relative to wall height and LED chip height. These parameter relationships provide clear manufacturing guidelines that balance light distribution performance with manufacturability.
Solution Approach 2:
The patent performs preliminary optimization of the geometric parameters during the design stage, establishing the mathematical relationships between H1, H2, and H3 before manufacturing. This preliminary determination of optimal dimensions allows manufacturers to directly fabricate components with the correct proportions without requiring complex real-time adjustments or iterative testing.
3Device complexity
If conventional light-emitting diode structure is used, then device simplicity is maintained, but brightness uniformity deteriorates in the central area
Solution Approach 1:
The patent segments the backlight unit into distinct functional layers: LED chips mounted on a circuit board, a reflective wall structure, fluorescent resin for wavelength conversion, a light diffusing layer for uniformity, and a light guide plate for distribution. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall structural simplicity and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized design improves luminous efficiency and light distribution uniformity, allowing for efficient mass production of lighting devices that meet the requirements of backlight modules by adjusting the height ratios and thicknesses of the wall and plate.
Implementation Method 1
Light emitting diode is a light-emitting element made of semiconductor material that can convert electrical energy into light
Implementation Method 2
yellow, red, green and other phosphors mixed in the silicon material to obtain a white light source
Implementation Method 3
The wall is formed on the circuit substrate to form a concave cup with properties of light transmission and reflection
Implementation Method 4
The plate covers the fluorescent resin and equipped with properties of light transmission and reflection
Data Source
AI summary
A light-emitting device includes a circuit substrate, a wall, a light-emitting diode chip, a fluorescent resin and a plate. The wall is formed on the circuit substrate to form a concave cup with properties of light transmission and reflection, and has a height of the wall is H2. The light emitting diode chip is die-bonded on the circuit substrate in the concave cup and a height of the light-emitting diode chip is H1. The fluorescent resin is filled in the concave cup and covered over the light-emitting diode chip. The plate is covered on the fluorescent resin and equipped with properties of light transmission and reflection. A maximum thickness of the plate is H3, wherein H3=A*(H2/H1)+B, a value of A ranges from 10.5 to 15.5, and a value of B ranges from 0.05 to 131.5.