LED Packaging via Conductive Adhesive Bonding
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Solution Overview
Problem
Current LED packaging methods are costly, complex, unreliable due to premature failure from residual stress and deformation, and not environmentally friendly, especially with the use of solder materials.
Innovation Solution
A light-emitting system with a p-doped and n-doped region, encapsulated in an encapsulant layer with exposed top and bottom sides, and conductive patterns formed on the encapsulant for electrical communication, using a method that involves flexible and non-flexible layers for encapsulation and conductive pattern formation, eliminating the need for traditional PCB assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire bonding and soldering packaging methods are used, then electrical connections can be established, but the package becomes costly, complex, and unreliable due to residual stress and deformation
Solution Approach 1:
The patent extracts and eliminates the traditional PCB assembly, wire bonding, and soldering components from the packaging process. Instead of using complex multi-step conventional packaging, the invention directly bonds the LED chip to the substrate using conductive adhesive, removing unnecessary intermediate components and processes that contribute to complexity and reliability issues.
Solution Approach 2:
The patent replaces the mechanical wire bonding and soldering system with a chemical bonding system using conductive adhesive. This substitution eliminates the need for precise mechanical alignment and complex bonding equipment, while avoiding the residual stress and deformation problems associated with thermal soldering processes.
2Object-affected harmful factors
If lead-free solder materials are used to improve environmental friendliness, then soldering can still be performed, but premature failure occurs due to lack of pliability and residual stress
Solution Approach 1:
The patent replaces the thermal soldering process (both leaded and lead-free) with a room-temperature or low-temperature conductive adhesive bonding process. This eliminates the thermal cycling and melting processes that cause residual stress and deformation, while providing adequate electrical and mechanical connection reliability without environmental concerns.
Solution Approach 2:
The patent changes the bonding temperature parameter from high-temperature soldering (melting point of solder) to room temperature or low-temperature curing of conductive adhesive. This parameter change eliminates thermal stress and deformation while maintaining electrical conductivity and mechanical strength of the connection.
3Ease of manufacture
If conventional PCB assemblies are used, then electrical circuits can be formed, but the design and fabrication become costly and time-consuming
Solution Approach 1:
The patent extracts and eliminates the entire PCB assembly layer from the packaging structure. Instead of mounting LEDs on a separate PCB that requires complex routing and assembly, the invention integrates the electrical connection function directly into the packaging substrate using conductive adhesive patterns, simplifying both design and manufacturing.
Solution Approach 2:
The patent merges the electrical connection function and mechanical support function into a single integrated substrate structure. The conductive adhesive serves dual purposes: providing mechanical bonding between chip and substrate while simultaneously establishing electrical connections, eliminating the need for separate PCB and wire bonding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a reliable, cost-effective, and environmentally friendly LED package that simplifies the fabrication process and enhances the structural integrity of the LED package, reducing the risk of premature failure.
Implementation Method 1
at least one light-emitting device is being encapsulated in an encapsulant layer
Implementation Method 2
conductive patterns formed on the encapsulant layer forming a circuit for connecting to a power source
Implementation Method 3
The relatively high power efficiency associated with LEDs has created an interest in using LEDs to displace conventional light sources
Data Source
AI summary
A light emitting system and related method are disclosed.