LED Package Conductive Grooves Prevent Solder Migration
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Solution Overview
Problem
Conventional light-emitting diode package structures face issues with solder migration to unintended portions, affecting performance and reliability by compromising optical efficiency and increasing the risk of encapsulation material delamination and moisture contamination.
Innovation Solution
The light-emitting diode package structure incorporates grooves on conductive units to prevent solder migration, featuring a first groove on the first conductive unit and a second groove on the second conductive unit, which divides their outer surfaces into separate parts, thereby blocking solder flow and maintaining the reflective contour and surface finish.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional light-emitting diode package structures are used without grooves on conductive units, then the structure is simple and manufacturing is easier, but solder migrates to unintended portions such as light reflecting regions, affecting optical efficiency and reliability
Solution Approach 1:
The conductive units are segmented by forming grooves that divide their outer surfaces into separated parts. This segmentation creates physical barriers that prevent solder from migrating across the entire conductive unit surface, thereby containing solder to intended areas while maintaining the overall structural integrity of the package
Solution Approach 2:
The grooves act as intermediary barrier structures between the solder and the light reflecting regions. These grooves serve as physical intermediaries that block solder migration paths without directly interfering with the electrical or optical functions of the conductive units and light emitting diode chips
2Reliability
If grooves are added to conductive units to block solder flow, then solder migration is prevented and optical efficiency is maintained, but the manufacturing process becomes more complex
Solution Approach 1:
The grooves segment the conductive unit surfaces, creating distinct zones that control solder flow. This segmentation is achieved through standard manufacturing techniques that form barriers without requiring complex multi-step processes, maintaining ease of manufacture while ensuring optical efficiency by preventing solder from reaching light reflecting regions
3Reliability
If grooves divide conductive unit surfaces into separated parts, then solder is blocked and encapsulation material delamination risk is reduced, but the device structure becomes more complex
Solution Approach 1:
The grooves create segmented zones on conductive units that limit solder spread. This segmentation prevents solder from reaching encapsulation material interfaces, thereby reducing delamination risk while adding minimal structural complexity through simple groove formations that integrate seamlessly with existing conductive unit designs
Data Source
AI summary
A light-emitting diode package structure, a light-emitting device and a method of making the same are provided. The light-emitting diode package structure includes an insulating base, a first conductive unit, a second conductive unit and at least one light-emitting diode chips. The first conductive unit is disposed on the insulating base. The second conductive unit is disposed on the insulating base and separated from the first conductive unit. The at least one light-emitting diode chips is electrically connected to the first conductive unit and the second conductive unit. Further, the first conductive unit has a first groove, and an outer surface thereof is divided by the first groove into two separated parts. In addition, the second conductive unit has a second groove, and the outer surface thereof is divided by the second groove into two separated parts.