Light Emitting Device Conductive Pattern Inductance Reduction
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Solution Overview
Problem
Existing light emitting devices face challenges in reducing inductance between the light emitting element array and the wiring substrate, which affects the efficiency of high-speed and high-frequency operations required for three-dimensional sensing applications.
Innovation Solution
A light emitting device configuration with a conductive pattern extending beyond the facing region of the light emitting element array, including a plurality of penetrating members through the base material to connect with the wiring substrate, reduces inductance by increasing the area of connection and utilizing a heat dissipation base material to manage heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conductive pattern is arranged only at a position facing the light emitting element array along the alignment direction, then the device complexity is reduced, but the inductance between the light emitting element array and the wiring substrate increases
Solution Approach 1:
The conductive pattern is extended from a one-dimensional alignment direction arrangement to a two-dimensional configuration that includes both the facing region along the alignment direction and the side surface region. This dimensional expansion allows the conductive pattern to connect with multiple penetrating members distributed across different locations, thereby reducing inductance without significantly increasing device complexity
Solution Approach 2:
The conductive pattern is divided into multiple segments: a first facing region connected to the light emitting element array along the alignment direction, and a first side surface region connected to a side surface of the light emitting element array. This segmentation allows the conductive pattern to establish multiple connection paths through different penetrating members, reducing overall inductance while maintaining manageable complexity
2Reliability
If the conductive pattern is extended beyond the facing region to include side surface regions, then the inductance is reduced, but the area of the base material increases
Solution Approach 1:
The conductive pattern is strategically placed in specific local regions: the first facing region along the alignment direction and the first side surface region along a side surface. This localized placement ensures that the conductive pattern extends only to the extent necessary for reducing inductance, avoiding unnecessary expansion of the base material area while achieving the desired electrical performance
Data Source
AI summary
Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.