LED Connection Element with Below-Plane Spring Compensation
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Solution Overview
Problem
Existing connection elements for LED lamps struggle to accommodate varying circuit board thicknesses and thermal interface layers while maintaining optimal contact forces and heat dissipation, leading to potential shadowing of light emission and increased electrical resistance.
Innovation Solution
A two-part connection element with a spring receiving space below the arrangement surface, allowing for a detent spring to provide sufficient contact pressure and accommodate large movement strokes, while minimizing height and avoiding light shadowing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the connection element height is minimized to avoid light shadowing, then light emission efficiency is improved, but there is insufficient space to accommodate the detent spring and compensate for varying circuit board thicknesses
Solution Approach 1:
The spring receiving space extends below the arrangement surface, utilizing the vertical dimension underneath the mounting plane to accommodate the detent spring. This allows the connection element to maintain a minimal height above the arrangement surface while providing sufficient space for the spring mechanism to compensate for varying circuit board thicknesses, thereby resolving the contradiction between light emission efficiency and adaptability.
2Illumination intensity
If the connection element height is minimized to avoid light shadowing, then light emission efficiency is improved, but there is insufficient space to accommodate the detent spring mechanism
Solution Approach 1:
The spring receiving space is positioned below the arrangement surface, utilizing the vertical dimension underneath the mounting plane. This spatial reconfiguration allows the detent spring mechanism to be accommodated without increasing the height of the connection element above the arrangement surface, thus maintaining light emission efficiency while providing necessary space for the spring mechanism.
3Reliability
If the detent spring exerts sufficient contact force to maintain electrical connection, then electrical contact resistance is reduced, but the spring forces require significant accommodation space
Solution Approach 1:
The spring accommodation space is located below the arrangement surface, utilizing the vertical dimension underneath the mounting plane. This allows the detent spring to exert sufficient contact force on the circuit board while the spring mechanism itself is positioned in the space below the arrangement surface, thereby maintaining electrical contact stability without requiring additional volume above the mounting plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures stable electrical and mechanical connection with minimal light shadowing and optimal heat dissipation, even with varying board thicknesses and thermal interfaces, by using a detent spring arrangement that compensates for tolerances and absorbs spring forces effectively.
Implementation Method 1
locking springs which are arranged in the outer ring, engage over the locking lugs of the inner ring and exert a tensile force on the inner ring in the direction of the arrangement surface
Implementation Method 2
contact fields for the electrical supply of the LED, with a frame which is intended to rest on an arrangement surface of a counter-bearing
Data Source
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AI summary
Connection element for the electrical connection of an LED light source, - wherein the LED light source has a circuit board provided with contact pads for the electrical supply of the LED, - with a frame that is intended to rest on an arrangement surface of a counter-bearing and to hold the circuit board on this arrangement surface, wherein the frame is formed by an outer ring and an inner ring, - with the inner ring, which is held within the outer ring and is intended to overlap the circuit board at least in some areas and thus hold the circuit board vertically to the arrangement surface on the counter-bearing, - with the outer ring, which is intended to surround the circuit board and hold the circuit board parallel to the arrangement surface on the counter-bearing, - with locking lugs formed by the inner ring, - with locking springs arranged in the outer ring,overlap the locking lugs of the inner ring and exert a tensile force on the inner ring in the direction of the arrangement surface, wherein a spring receiving space for the locking spring is provided, which extends in relation to the frame resting on the arrangement surface into an area below the arrangement surface.