LED Contact Structures for Uniform Current Distribution
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Solution Overview
Problem
Contact structures in light-emitting diodes (LEDs) often fail to distribute current uniformly, leading to non-uniform light emission, decreased output, and performance degradation.
Innovation Solution
The design includes strategically positioned electrically conductive pads and contact members with varying shapes and compositions to enhance current distribution, using non-ohmic layers and bus bars to promote uniform current spreading across the emission surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional contact structures are used in LEDs, then the device is simple to manufacture, but current distribution is non-uniform leading to performance degradation
Solution Approach 1:
The contact structure is divided into multiple discrete components: conductive pads positioned at specific locations, contact members extending from the pads, and non-ohmic layers interspersed between them. This segmentation allows each component to perform its specific function in optimizing current distribution, transforming a simple but ineffective contact structure into a complex but highly effective multi-component system that ensures uniform current flow across the LED emission surface.
2Manufacturing precision
If contact structures are designed to spread current uniformly, then light emission uniformity improves, but the manufacturing process becomes more complex
Solution Approach 1:
Different regions of the contact structure have different properties: conductive pads provide high conductivity pathways, non-ohmic layers provide controlled resistance, and contact members provide structural support and electrical connection. Each layer and component is strategically positioned to create local variations in electrical properties that collectively achieve uniform current distribution across the entire emission surface, rather than relying on a uniform structure throughout.
3Temperature
If simple contact structures are used, then manufacturing is easier, but overheating and performance degradation occur
Solution Approach 1:
Non-ohmic layers are introduced as intermediary elements between the conductive pads and contact members. These non-ohmic layers act as mediators that control and regulate current flow, preventing excessive current concentration at specific points that would cause localized overheating. The non-ohmic layers distribute current more evenly across the contact structure, thereby reducing thermal hotspots and improving overall device thermal management.
Data Source
AI summary
Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. The contact structures are particularly suitable for use in a variety of light-emitting devices, including LEDs.