Light Emitting Device Convex Bonding Structure
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Solution Overview
Problem
In light emitting devices combining semiconductor laser light sources and light-transmitting members, adhesives can burn due to laser light, and there is a risk of the light-transmitting member falling off or peeling, leading to inefficiencies and reliability issues.
Innovation Solution
A light emitting device design featuring a head portion with a convex surface and a light-transmitting member with a recessed surface, preventing adhesive entry into the through hole and enhancing adhesion, while a high reflectance member improves light output efficiency and a fixing unit ensures secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to bond the light-transmitting member and holder, then bonding strength is improved, but adhesive may enter the through hole and get burned by laser light
Solution Approach 1:
The bonding surface is segmented into two distinct regions: a first bonding region that allows adhesive application for strong bonding, and a second bonding region (the convex portion) that prevents adhesive entry into the through hole. This segmentation resolves the contradiction by spatially separating the bonding function from the protective function.
Solution Approach 2:
Different regions of the bonding interface are given different properties: the first bonding region has adhesive application capability for strength, while the convex portion in the second bonding region has adhesive-blocking property to prevent harmful adhesive burning. This local differentiation resolves the contradiction between bonding strength and preventing adhesive burning.
2Reliability
If the light-transmitting member is firmly fixed to prevent falling off, then reliability is improved, but the structure becomes more complex
Solution Approach 1:
The fixing unit combines multiple functions into a single integrated structure: it provides mechanical fixing to prevent falling off, creates the convex portion for adhesive control, and forms the second bonding region. This merging achieves reliable fixing without adding separate complex components.
Solution Approach 2:
The fixing unit serves multiple purposes simultaneously: structural support, adhesive barrier creation, and positioning. This multi-functionality improves reliability while avoiding the need for additional separate components that would increase complexity.
3Area of stationary object
If adhesive is spread to ensure bonding coverage, then bonding area is improved, but adhesive may reach the through hole increasing burning risk
Solution Approach 1:
The bonding area is segmented into a first bonding region for adhesive application and a convex portion that acts as a barrier. This segmentation allows sufficient bonding area while preventing adhesive from reaching the through hole.
Solution Approach 2:
The convex portion adds a vertical dimension (height) to the bonding interface, creating a three-dimensional barrier that blocks adhesive flow in the horizontal direction toward the through hole, while still maintaining adequate bonding surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents adhesive entry into the through hole, facilitates positioning, enhances heat dissipation, reduces peeling risks, and improves light output efficiency by reflecting side-emitted light back into the light-transmitting member.
Implementation Method 1
an optical system configured to condense the light from the semiconductor light emitting element and locally irradiate the light-transmitting member with the light
Implementation Method 2
The light-transmitting member irradiated with the laser light can emit both the transmitted laser light from the semiconductor laser light source 210 and light (luminescence) that is emitted due to excitation of phosphor by the laser light
Implementation Method 3
a high reflectance member configured to reflect light emitted from the light-transmitting member
Data Source
AI summary
A light emitting device can include a head portion including a surface including a convex portion, a back surface on the opposite side, and a through hole penetrating a tip surface of the convex portion and the back surface; a light-transmitting member including a surface and a back surface on the opposite side, the back surface including a first recess to be fitted to the convex portion; an adhesive bonding part of the surface of the head portion around the convex portion to the back surface of the light-transmitting member while the convex portion is fitted to the first recess and the first recess covers the through hole; a semiconductor light emitting element that emits light passing through the through hole for irradiation of the light-transmitting member; and an optical system condensing the light from the semiconductor light emitting element and locally irradiates the light-transmitting member with the light.