LED Fixture Cooling Conduit for External Heat Rejection
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Solution Overview
Problem
Conventional lighting systems, particularly LED fixtures, face challenges in managing heat effectively, leading to increased cooling costs and potential damage due to inadequate heat sinking capabilities, especially in enclosed spaces and outdoor applications where heat rejection is difficult.
Innovation Solution
The implementation of a system that includes a solid-state light source, an enclosure, and a fluid transfer conduit to efficiently capture and manage heat generated by LEDs, allowing for the transfer of heat away from the light source through a thermally insulated conduit, which can be routed to external HVAC systems, geothermal loops, or other heat management systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED lighting systems are used in enclosed spaces, then energy efficiency is improved, but heat management becomes difficult leading to increased cooling costs
Solution Approach 1:
The patent extracts heat from the LED fixture using a fluid transfer conduit that connects to an external heat management system. This removes the harmful heat effect from the enclosed space while preserving the energy-efficient LED lighting function, resolving the contradiction between energy efficiency and cooling costs.
Solution Approach 2:
The patent introduces a fluid transfer conduit as an intermediary between the LED heat source and the external HVAC system. This mediator transfers heat away from the enclosed space, allowing the LED to operate efficiently without contributing to cooling costs.
2Temperature
If conventional heat sinking is used, then heat removal is achieved, but the space illuminated by LED remains affected by heat
Solution Approach 1:
The patent extracts heat from the LED assembly and redirects it through a fluid transfer conduit to an external location. This separates the heat removal function from the illuminated space, allowing heat to be removed without affecting the quality of light or the temperature of the illuminated area.
Solution Approach 2:
The patent moves heat management from the traditional two-dimensional heat sink surface to a three-dimensional fluid transfer system that extends heat rejection to an external dimension. The fluid conduit carries heat away from the enclosed space through a different spatial pathway, preventing heat from contaminating the illuminated space.
3Loss of energy
If heat is concentrated on the back side of LED, then heat capture efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the fluid transfer conduit with the existing LED mounting structure and heat sink, creating a multi-functional assembly that combines lighting, heat generation, and heat transfer functions. This reduces overall system complexity by eliminating separate heat capture components while maintaining high heat capture efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the burden on HVAC systems, increases LED lumen output, extends the service life of lighting fixtures, and allows for the beneficial reuse of heat, thereby lowering maintenance and replacement costs while maintaining optimal operating temperatures.
Implementation Method 1
a fluid transfer conduit allowing for the transfer of heat away from the light source
Implementation Method 2
The heat removed from the enclosure via the fluid transfer conduit may be moved
Implementation Method 3
transfer of heat away from the light source through a thermally insulated conduit
Data Source
AI summary
Systems and methods for solid-state light source heat management are provided. A solid-state light source, e.g. having one or more LEDs, can be mounted within an enclosure. In some embodiments, a heat sink associated with semiconductor material and/or power electronics can be placed on a separate side of the enclosure that is thermally insulated or separated from the state-light source. The enclosure can include a first side or portion that allows light from the solid-state-light source (e.g., LEDs) to pass through to a target area. A fluid transfer conduit may be connected to the second side or portion of the enclosure for passing a fluid (e.g., air, water, coolant, etc.) across the heat sink to transport heat generated by the power electronics and/or semiconductor material away. The heated fluid can then be routed to, as examples, an HVAC system, a vent, water heating systems, heat exchanger systems, and/or storage systems (e.g., batteries).


