LED Package Cover Structure for Uniform Multi-Chip Beamshaping
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Solution Overview
Problem
Conventional multi-chip LED components exhibit far-field emission pattern variations due to separate light emission sources, resulting in undesirable dark regions between LED chips, which are difficult to minimize with existing lenses or optics.
Innovation Solution
A cover structure with channels and light-altering materials is used to redirect and diffuse light emitted from multiple LED chips, featuring a predetermined orientation and distribution pattern of channels within a light-transmissive material to modify the emission pattern and reduce dark regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional lenses or optics are used to minimize dark regions between LED chips, then the emission pattern uniformity is improved, but the device complexity increases and manufacturing precision requirements become more stringent
Solution Approach 1:
The patent extracts the beamshaping function from separate external optics and integrates it into the cover structure itself. The cover structure contains embedded channels and light-altering materials that perform beamshaping internally, eliminating the need for additional complex optical components while achieving uniform emission patterns.
Solution Approach 2:
The patent merges the cover structure with beamshaping functionality by integrating channels and light-altering materials directly into the cover. This combination eliminates the need for separate optics components, reducing device complexity while maintaining emission uniformity.
2Power
If multiple LED chips are mounted on a substrate, then the light output is increased, but far-field emission pattern variations and dark regions appear
Solution Approach 1:
The patent introduces channels and light-altering materials as intermediary elements between the multiple LED chips and the external environment. These intermediaries redirect and diffuse light from separate chips, merging their emission patterns to create a uniform overall output while preserving the high light output benefit of multiple chips.
3Illumination intensity
If channels with predetermined orientation and distribution pattern are implemented in the cover structure, then the far-field emission pattern variation is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs a channel structure within the cover material that creates a porous or tunneled architecture. This approach allows light redistribution through the channel network, achieving emission uniformity while the channels can be formed using standard manufacturing techniques rather than requiring ultra-precise positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cover structure effectively reduces far-field emission pattern variations, creating a uniform light emission profile by redirecting and diffusing light, eliminating dark regions between LED chips and enhancing the overall light emission profile.
Implementation Method 1
The cover structure can include channels, or tunnels, within an otherwise light-transmissive material that perform beamshaping of at least a portion of the light emitted from the multiple LED chips
Implementation Method 2
The beamshaping can be a result of a predetermined orientation and/or distribution pattern of the channels that redirect the light
Implementation Method 3
The cover structure can also include textured surfaces or light-altering materials that can further diffuse the light emitted from the multi-chip LED component
Data Source
AI summary
Solid-state lighting devices, and more particularly, cover structures for beamshaping for multi-chip light emitting diode (LED) components are disclosed. The cover structure can reduce the far field emission pattern variation due to having different light emission sources on a multi-chip LED component. The cover structure can include channels, or tunnels, within an otherwise light-transmissive material that perform beamshaping of at least a portion of the light emitted from the multiple LED chips. The beamshaping can be a result of a predetermined orientation and/or distribution pattern of the channels that redirect the light. The cover structure can also include textured surfaces or light-altering materials that can further diffuse the light emitted from the multi-chip LED component.