LED Module Cover Layer for Precise Board Fixation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting diodes (LEDs) face challenges in accurately fixing to circuit boards due to the difficulty in maintaining a minimal distance between the LED and the circuit board, especially when using solder, which complicates precise positioning.
Innovation Solution
A light emitting diode module design incorporating a cover layer between the LED and a conductive pattern layer, with specific configurations to minimize distance and enhance fixation, including a cover layer with overlapping regions and distinct cover parts, and a solder design with inclined surfaces to stabilize the LED on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the distance between the light emitting diode and the circuit board is increased, then it becomes easier to fix the LED, but the positioning accuracy deteriorates due to increased solder amount
Solution Approach 1:
The patent introduces a cover layer as an intermediary component between the light emitting diode and the circuit board. This cover layer includes a cavity that receives the LED and positioning protrusions that engage with positioning holes in the circuit board, thereby mediating the connection and enabling both easy fixation and precise positioning without relying solely on solder
Solution Approach 2:
The fixing mechanism is segmented into multiple functional components: the cover layer with cavity for receiving LED, positioning protrusions for engagement, and separate solder connections. This segmentation allows each component to perform its specific function optimally - the cover layer provides mechanical support and positioning, while solder provides electrical connection
2Manufacturing precision
If the distance between the light emitting diode and the circuit board is decreased to improve positioning accuracy, then positioning accuracy improves, but the ease of fixation deteriorates
Solution Approach 1:
The cover layer acts as a mediator that allows the LED to be positioned at an optimal distance from the circuit board while maintaining both positioning accuracy through positioning protrusions and ease of fixation through the cavity structure that facilitates LED placement
3Manufacturing precision
If a cover layer is added between the light emitting diode and the circuit board, then positioning accuracy and fixation stability improve, but the device complexity increases
Solution Approach 1:
The cover layer is designed to perform multiple functions simultaneously: it provides mechanical support for the LED through the cavity, enables precise positioning through positioning protrusions, offers electrical insulation, and facilitates thermal management. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity
4Manufacturing precision
If the cover layer is designed with overlapping regions to minimize distance, then positioning accuracy improves, but the manufacturing complexity increases
Solution Approach 1:
The positioning protrusions are pre-formed on the cover layer during manufacturing, and the overlapping regions are designed in advance to achieve minimal distance between LED and circuit board. This preliminary preparation simplifies the assembly process and reduces manufacturing complexity during final assembly
Data Source
AI summary
According to an aspect of the present disclosure, there may be provided a light emitting diode module, including: a light emitting diode configured to irradiate light; a conductive pattern layer electrically connected to the light emitting diode; and a cover layer disposed on the conductive pattern layer and electrically insulated, wherein the cover layer is disposed between the light emitting diode and the conductive pattern layer to have a region that at least a portion of the cover layer overlaps with the light emitting diode when viewed from above the light emitting diode.