Light-Transmitting Cover Undulations to Prevent LED Cover Detachment
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Solution Overview
Problem
Conventional semiconductor light-emitting devices face issues with the detachment of their light-transmitting covers, which can lead to undesirable direct visibility of light from the semiconductor light-emitting element.
Innovation Solution
A semiconductor light-emitting device design featuring a support with a base and conductive parts, and a cover with undulation parts bonded to the support using a bonding material, where the undulation parts are more uneven than the rear surface, enhancing the bonding strength and preventing cover detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat cover is used to transmit light, then light transmission is achieved, but the cover may detach from the support
Solution Approach 1:
The cover incorporates undulation parts with curved surfaces instead of a flat surface. These undulation parts protrude toward the light-emitting element and have curved surfaces that reflect and diffuse light. The curvature of the undulation parts increases the surface area for bonding and creates mechanical interlocking with the bonding material, thereby preventing cover detachment while maintaining light transmission functionality.
2Reliability
If the cover is made with undulation parts to prevent detachment, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The undulation parts are formed with curved surfaces that can be manufactured using standard molding techniques. The curvature is designed to be achievable through conventional manufacturing processes, balancing the need for enhanced bonding strength with manufacturing feasibility. The undulation pattern allows for efficient molding and assembly operations.
Solution Approach 2:
The height, curvature radius, and spacing of the undulation parts are optimized to achieve sufficient bonding strength while remaining compatible with standard manufacturing tolerances and processes. By carefully controlling these geometric parameters, the design achieves reliable bonding without requiring specialized or complex manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses cover detachment, improving the device's structural integrity and preventing unwanted light exposure, thereby maintaining the desired operational characteristics.
Implementation Method 1
the base layer includes a plurality of undulation parts bonded to the support by a bonding material
Data Source
AI summary
A semiconductor light-emitting device, includes: a semiconductor light-emitting element; a support including a base and a conductive part and configured to support the semiconductor light-emitting element; and a cover configured to overlap the semiconductor light-emitting element as viewed in a first direction, and to transmit light from the semiconductor light-emitting element, wherein the cover includes a base layer having a front surface and a rear surface which transmit the light from the semiconductor light-emitting element and face opposite sides to each other in the first direction, wherein the rear surface faces the semiconductor light-emitting element, wherein the base layer includes a plurality of undulation parts bonded to the support by a bonding material, and wherein the undulation parts are more uneven than the rear surface.