LED Chip Side Surface Cup Geometry for Uniform Fluorescent Distribution
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Solution Overview
Problem
Existing light emitting diode (LED) packages face issues with fluorescent material settling at the bottom of the resin, leading to uneven distribution and reduced luminous efficiency, causing variations in color temperature and luminous efficiency.
Innovation Solution
A method involving a fluorescent substrate with conductive vias and a resin portion that encapsulates the side surfaces of the LED chip, allowing for uniform distribution of fluorescent substances and improved light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If fluorescent material is dispersed within the resin portion, then white light emission is achieved, but the fluorescent material sinks to the bottom of the cup during curing
Solution Approach 1:
The patent applies the equipotentiality principle by designing a cup structure where the side surface is positioned at a specific height relative to the LED chip. This geometric configuration creates a stable environment during curing that prevents fluorescent material from sinking, maintaining uniform distribution throughout the resin portion while enabling effective white light emission.
Solution Approach 2:
The patent utilizes parameter changes by controlling the height position of the cup's side surface relative to the LED chip's side surface. By optimizing this geometric parameter, the curing process maintains uniform fluorescent material distribution without sinking, resolving the contradiction between achieving white light emission and maintaining composition stability.
2Use of energy by moving object
If fluorescent material is dispersed in resin, then wavelength conversion is enabled, but luminous efficiency degrades due to material settling
Solution Approach 1:
The patent applies equipotentiality by designing the cup geometry to create a stable curing environment that prevents fluorescent material settling. This ensures uniform wavelength conversion throughout the resin portion, maximizing energy utilization and preventing luminous efficiency loss that would occur with material aggregation at the bottom.
Solution Approach 2:
The patent optimizes the height parameter of the cup's side surface to maintain uniform fluorescent material distribution during curing. This geometric parameter control ensures consistent wavelength conversion efficiency across the entire resin volume, preventing energy loss from uneven material distribution.
3Use of energy by moving object
If fluorescent material is distributed in resin, then light conversion function is achieved, but spatial distribution becomes uneven
Solution Approach 1:
The patent applies equipotentiality through the cup's geometric design, where the side surface height creates a stable environment during curing. This prevents gravitational settling and ensures uniform spatial distribution of fluorescent material, achieving precise manufacturing consistency while maintaining effective light wavelength conversion.
Solution Approach 2:
The patent controls the height parameter of the cup's side surface relative to the LED chip to achieve uniform fluorescent material distribution. This precise geometric parameter optimization ensures consistent spatial uniformity across products, resolving the manufacturing precision issue while maintaining light conversion functionality.
4Reliability
If conventional packaging structure is used, then LED protection is achieved, but product variations occur due to uneven fluorescent material distribution
Solution Approach 1:
The patent maintains the protective cup structure while applying equipotentiality through optimized geometry. The side surface height design creates a stable curing environment that prevents fluorescent material settling, ensuring consistent product composition across batches while preserving the protective function of the packaging structure.
Solution Approach 2:
The patent optimizes the geometric parameter of the cup's side surface height to prevent fluorescent material distribution issues during curing. This parameter control ensures consistent product composition and reduces variations between products, while maintaining the protective packaging structure's integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances luminous efficiency and achieves uniform white light emission by ensuring even distribution of fluorescent materials, reducing variations in color temperature and improving product characteristics.
Implementation Method 1
a fluorescent material, capable of converting the wavelength of light emitted from the light emitting diode 11
Data Source
Figure 1~3
Figure 4A~4C
Figure 5~6B
AI summary
Provided is a light emitting diode device (100). The light emitting diode device includes a light emitting diode chip (101) having a first surface on which first and second electrodes (103a,103b) are disposed, and a second surface opposing the first surface, a wavelength conversion portion (102) including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions (104a,104b) each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.