Chip-Scale LED Package With Cup-Shaped Support Structure
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Solution Overview
Problem
Chip-scale LED packages face challenges in reducing manufacturing costs while maintaining optical efficiency and uniform luminance, as the decrease in street width between discrete dies leads to reduced reflection regions and optical loss.
Innovation Solution
A downscaled LED package design featuring a light-emitting structure with a transmissive material layer and a support structure that includes a cup-shaped support covering the side and bottom surfaces, with a sloped or stepped interface and varying thicknesses to enhance light reflection efficiency, and a transmissive material layer with wavelength conversion or lens capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the street width between discrete dies is decreased to achieve higher density packaging, then the productivity and quantity of LEDs per wafer is improved, but the reflection region is reduced causing optical loss and reduced luminance
Solution Approach 1:
The support structure extends vertically to form sidewall units that cover the side surfaces of light-emitting structures, utilizing the vertical dimension to create reflection surfaces that were previously unavailable in planar packaging. This adds a third dimension to light reflection, compensating for reduced lateral reflection space in high-density packaging
Solution Approach 2:
The support structure uses different materials with different light reflection efficiencies at different locations - the bottom unit uses high reflection efficiency material for light emitted from bottom surfaces, while sidewall units use appropriate materials for side surface reflection, optimizing local optical properties for each region
2Loss of energy
If the support structure includes multiple materials with different reflection efficiencies, then the light reflection efficiency is improved, but the device complexity increases
Solution Approach 1:
The support structure is divided into distinct segments - a bottom unit and sidewall units - that can be manufactured separately and then assembled. This segmentation allows each part to be optimized for its specific function while simplifying the overall manufacturing process through modular construction
Solution Approach 2:
The support structure combines different materials with different light reflection efficiencies in specific configurations, creating a composite structure that optimizes optical performance. The first material provides high reflection for certain regions while the second material serves other optical functions, achieving superior overall light reflection efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design inhibits optical loss and achieves uniform luminance, reducing manufacturing costs while maintaining high light reflection efficiency and desired color coordinates, even in densely packed wafer-level packaging.
Implementation Method 1
a support structure having a width equal to a width of the LED package, the support structure including a bottom unit defining the electrode at a lower level than the bottom surface of the light-emitting structure and covering the bottom surface of the light-emitting structure, and a sidewall unit covering at least a portion of a side surface of the transmissive material layer and a side surface of the light-emitting structure
Data Source
AI summary
A light-emitting diode (LED) package includes a light-emitting structure, a transmissive material layer on the light-emitting structure, and a support structure covering at least a portion of a side surface of the transmissive material layer, a side surface of the light-emitting structure, and at least a portion of a bottom surface of the light-emitting structure.