LED Curing Mount Cooling with Removable Heat Pipe Collars

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Solution Overview

Problem

Existing LED print curing systems face challenges in efficiently cooling LEDs due to the difficulty in attaching thermal transfer members like heat pipes to the LED heat sinks without damaging the LEDs, especially when using different metals, which requires additional coatings and is costly and complex.

Innovation Solution

A cooling system with removably connected thermal transfer members featuring a collar that mates with a bore in the LED mount, allowing for secure attachment without soldering, using a threaded engagement for precise installation and minimizing thermal resistance with a high-performance thermal interface material like ceramic paste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat pipes are soldered to the base as a pre-built unit, then thermal efficiency is improved, but attachment of delicate LEDs becomes difficult and risk of damage increases

Engineering Contradiction:

Improvethermal efficiencyVSAvoidease of LED attachment

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The cooling system is divided into separate modules: the LED mount with bore, the thermal transfer member with collar, and the cooling module. This segmentation allows the thermal transfer member to be attached to the LED mount before LED installation, eliminating the risk of damaging LEDs during soldering while maintaining thermal efficiency through the collared connection.

Inventive Principle:

Principle #1Segmentation

2Strength

If soldering is used to attach thermal transfer members, then secure connection is achieved, but delicate LEDs may be damaged during the process

Engineering Contradiction:

Improveconnection strengthVSAvoidheat damage to LEDs

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The thermal transfer member with collar is prepared and attached to the LED mount in advance, before the delicate LEDs are installed. This preliminary action ensures that the secure connection is established without exposing the LEDs to the high temperatures and potential damage associated with soldering processes.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If different metals are used for base and heat pipes, then material selection flexibility is improved, but additional coating is required for soldering

Engineering Contradiction:

Improvematerial selection flexibilityVSAvoidcoating requirement

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The collar acts as an intermediary component between the thermal transfer member and the LED mount. It provides a standardized mechanical interface that eliminates the need for direct soldering between dissimilar metals, thereby removing the requirement for additional coating while maintaining secure attachment and thermal transfer efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Reliability

If copper heat pipes are used, then thermal conductivity is improved, but weight and machining difficulty increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidweight of heat pipes

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The invention changes the connection parameter from soldered to mechanically coupled via collar. This allows the use of alternative materials with lower density and better machinability while maintaining effective thermal transfer. The collar design ensures secure attachment and good thermal contact without requiring the high density and machining difficulty associated with traditional copper heat pipes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient, uniform cooling of LEDs, reduces the risk of overheating, and allows for easier installation and maintenance, while also being environmentally friendly by enabling the reuse of thermal transfer members, thus extending LED lifespan and reducing waste.

Implementation Method 1

The LEDs are provided on a base having a heat sink and heat pipes are used to draw heat away from the LEDs to a cooling module

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat pipes have an evaporator section near to the LEDs and a condenser section at or near to the cooling module

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

The heat pipes have an evaporator section near to the LEDs and a condenser section at or near to the cooling module

Methodology Applied

Scientific EffectCondensation: Condensation

Data Source

PatentUS20230307601A1Cooling system for LED curing apparatus

Publication Date: 2023.09.28 GEWEC

AI summary

An LED curing apparatus cooling system comprising at least one LED mount for mounting a plurality of LEDs; at least one bore in the LED mount; at least one thermal transfer member comprising an evaporator section and a condenser section, wherein the or each thermal transfer member is removably connected to a bore; and wherein each thermal transfer member comprises a collar having an outer surface to mate with an inner surface of a bore.