LED Package Curved Reflection and Radial Thermal Pins

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Solution Overview

Problem

Existing LED packages face challenges in maximizing light emission and heat dissipation, leading to reduced luminance and lifespan due to ineffective light extraction and heat management, particularly in high-power applications.

Innovation Solution

The LED package incorporates a body unit with radial thermal pins for enhanced heat dissipation, a reflection unit with a curved cross-section to increase light emission efficiency, and lead frames with a specific structure for stable electrical connections and heat transfer, along with molding materials to secure components and improve thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional LED packages are used, then the structure is simple and easy to manufacture, but light emission efficiency is low and heat dissipation is ineffective

Engineering Contradiction:

Improvelight emission efficiencyVSAvoidpackage structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The reflection unit is designed with a curved cross-section (semicircular, rounded edges with flat top) instead of flat surfaces. This curvature optimizes light reflection paths, increases light extraction efficiency from the LED chip, and expands the emission range while maintaining effective heat dissipation.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The body unit includes multiple thermal pins protruding radially from the outer circumferential surface. This segmentation of the heat dissipation structure increases the surface area for heat transfer and creates pathways for efficient thermal management without significantly complicating the overall package structure.

Inventive Principle:

Principle #1Segmentation

2Illumination intensity

If high-power LED chips are used, then luminance is high, but heat generation increases and lifespan is reduced due to poor heat dissipation

Engineering Contradiction:

ImproveluminanceVSAvoidlifespan

Core Design Contradiction:

Illumination intensityVSDuration of action of stationary object

Solution Approach 1:

The body unit includes multiple thermal pins protruding radially from the outer circumferential surface. This segmentation of the heat dissipation structure increases the surface area for heat transfer and creates pathways for efficient thermal management, allowing high-power LED chips to operate at high luminance without excessive heat accumulation that would reduce lifespan.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The curved reflection unit is designed to not only reflect light but also facilitate heat dissipation. The cavity structure receives the LED chip and the curved surfaces help channel heat away from the chip while maintaining high light extraction efficiency, converting the heat problem into part of the overall thermal management solution.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If conventional reflection units are used, then the structure is simple, but light extraction efficiency is low and emission range is limited

Engineering Contradiction:

Improvelight extraction efficiencyVSAvoidreflection unit structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The reflection unit extends in the radial direction from the body unit, creating a three-dimensional cavity structure. This dimensional extension provides multiple reflection surfaces and paths, increasing the probability of light extraction and expanding the angular emission range compared to conventional two-dimensional reflection structures.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves high light emission efficiency and wide emission range while effectively dissipating heat, thereby enhancing the lifespan and performance of LED packages in high-power applications.

Implementation Method 1

a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside

Methodology Applied

Scientific EffectLight reflection: Reflection

Implementation Method 2

a body unit including a plurality of thermal pins protruding from an outer circumferential surface thereof in a radial manner

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

techniques that extract the maximum amount of light emitted from LED chips to the outside play a vital role

Methodology Applied

Scientific EffectHeat dissipation: Convection

Data Source

PatentUS8344399B2LED package with wide emission range and effective heat dissipation

Publication Date: 2013.01.01 SAMSUNG ELECTRONICS CO LTD

AI summary

There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.