LED Daughterboard Assembly for Precise Mini-LED Display Alignment
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Solution Overview
Problem
The mass transfer and alignment of miniature LEDs in display devices are time-consuming and prone to tolerance issues, hindering their commercial application due to the miniaturization and large number of LEDs required.
Innovation Solution
An assembled LED display device comprising a system motherboard with a drive power circuit and gate control circuit, where daughterboards with LED units and transistor switches are arranged in a matrix, allowing for efficient connection and reduced transfer of LEDs, thereby alleviating alignment and deformation problems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mass transfer of miniature LEDs is performed individually, then alignment precision can be maintained, but the process becomes extremely time-consuming and inefficient
Solution Approach 1:
The patent divides the LED array into multiple daughterboards, each containing a subset of LEDs. This segmentation allows parallel processing and assembly of multiple LED groups simultaneously, dramatically improving transfer efficiency while maintaining alignment precision through controlled substrate fabrication
Solution Approach 2:
The patent pre-assembles multiple LEDs onto a common substrate to form complete daughterboards before final assembly. This preliminary action on the substrate level enables batch processing and reduces the number of individual transfer operations required during final assembly
2Quantity of substance
If the number of LEDs is increased to achieve high-resolution displays, then display quality improves, but the complexity and time required for mass transfer increases significantly
Solution Approach 1:
The patent segments the large-scale LED array into multiple manageable daughterboards, each containing a specific portion of the total LEDs. This segmentation reduces the complexity of handling and assembling individual LEDs while achieving high-resolution displays through the collective arrangement of multiple daughterboards
Solution Approach 2:
The patent creates standardized daughterboards that can be universally applied and assembled in different configurations to achieve various display resolutions. This multi-functionality allows the same daughterboard design to serve multiple purposes and scale to different display sizes
3Manufacturing precision
If individual LED transfer is performed to ensure precise placement, then alignment accuracy is maintained, but the process duration becomes excessively long
Solution Approach 1:
The patent performs preliminary LED placement and connection work on the substrate level before final assembly. This preliminary action includes forming conductive patterns, placing LEDs in predetermined positions, and establishing electrical connections, thereby reducing the time required for final assembly while maintaining placement accuracy
Solution Approach 2:
The patent combines multiple LED placement operations into a single substrate-level process. By merging the placement of multiple LEDs onto one substrate in a batch operation, the system achieves both time efficiency and placement precision through coordinated processing
Data Source
AI summary
An assembled LED display device includes a system motherboard, and multiple to-be-assembled daughterboards assembled on the system motherboard. The system motherboard includes a drive power circuit including multiple power lines, and a gate control circuit including multiple gate lines. Each to-be-assembled daughterboard includes a substrate, at least one transistor switch, and a plurality of LED units disposed on the substrate and each including multiple LEDs connected to a same one of the at least one transistor switch. The LEDs of the LED units of the to-be-assembled daughterboards are arranged in a matrix having multiple rows and multiple columns. With respect to each column, the LEDs in the column are connected to the power line corresponding to the column. With respect to each to-be-assembled daughterboard, gate terminal(s) of the at least one transistor switch is(are) connected to the gate line corresponding to the to-be-assembled daughterboard.