LED-Diamond NV Chip Integration for Compact Quantum Sensing
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Solution Overview
Problem
The lack of compact and cost-effective integrated light sources for NV-based quantum sensing systems limits their practical applications due to large size and high economic costs, and the absence of portability.
Innovation Solution
A compact LED chip integrated with a diamond sensor, utilizing a gallium-nitride (GaN) LED chip as a proximity light source for NV excitation, eliminating the need for additional optical elements and enabling on-chip quantum sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complicated laser system is used for NV excitation, then quantum sensing performance is achieved, but device size becomes large (~m³) and cost increases
Solution Approach 1:
The patent combines the light source (LED) and the quantum sensor (diamond with NV centers) into a single integrated device. The LED chip is directly bonded to the diamond substrate, eliminating the need for separate laser systems and optical components. This merging reduces the device volume from ~m³ to ~mm³ while maintaining quantum sensing functionality through the LED's ability to excite NV centers at room temperature
Solution Approach 2:
The patent replaces expensive, complex laser systems with inexpensive LED chips that can be mass-produced using standard semiconductor fabrication techniques. The LED-based solution significantly reduces cost while achieving the necessary excitation for NV quantum sensing, making the technology economically viable for widespread application
2Reliability
If a complicated laser system with various accessories is adopted, then NV excitation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates the light source and sensor into a single monolithic device where the LED chip is directly bonded to the diamond substrate. This eliminates the need for multiple separate components and their associated alignment and assembly procedures, dramatically simplifying manufacturing while maintaining NV excitation capability
Solution Approach 2:
The integrated LED-diamond structure is self-contained, with the LED chip providing both the excitation light and serving as part of the optical path. The device requires no external optical accessories or complex alignment procedures, making it easy to manufacture and deploy
3Volume of stationary object
If a compact LED chip integrated with diamond sensor is used, then device size is reduced to ~mm³ and cost is lowered, but integration complexity must be managed
Solution Approach 1:
The patent achieves compact integration by directly bonding the LED chip to the diamond substrate, creating a thin, integrated structure. This merging eliminates the need for complex optical paths and multiple components, reducing device size to ~mm³ while keeping the integration process manageable through standard semiconductor bonding techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated device reduces size to ~mm 3< volume, significantly lowering costs and enhancing portability, improving quantum sensing performance and expanding practical applications.
Implementation Method 1
an LED chip generating light having a first wavelength
Implementation Method 2
the diamond with nitrogen-vacancy centers generates light having a second wavelength after excitement with light having the first wavelength
Implementation Method 3
NV-based quantum sensing
Data Source
Figure 1
Figure 2a~2d
Figure 3a~3d
AI summary
A small volume optoelectronic chip containing an LED chip having embedded therein a diamond with nitrogen-vacancy centers, wherein the LED chip generates light having a first wavelength, and the diamond with nitrogen-vacancy centers generates light having a second wavelength after excitement with light having the first wavelength.