LED Die Plating Mounting on Non-Transparent Substrates
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Solution Overview
Problem
The challenge is to develop a method for manufacturing a light emitting device that can effectively mount a light emitting element on a wiring substrate, regardless of whether the substrate is transparent or non-transparent, to meet increasing demands for high thermal conductivity and high integration of drive circuits.
Innovation Solution
The method involves providing a light emitting element with p-side and n-side electrodes on the same surface, forming wiring seed layers on a substrate with a predetermined spacing, creating a resist pattern, and using this pattern as a mask for plating to connect the wiring seed layers with the electrodes, allowing the light emitting element to be suitably mounted on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a non-transparent substrate is used to meet high thermal conductivity and high integration requirements, then thermal conductivity and integration capabilities are improved, but light irradiation cannot pass through the substrate to cure adhesive materials, making it impossible to mount light emitting elements using conventional methods
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: first forming wiring seed layers on the substrate, then applying adhesive material, placing light emitting elements, and finally performing plating to establish electrical connections. This segmentation allows each step to be optimized independently, enabling the use of non-transparent substrates while maintaining manufacturing feasibility.
Solution Approach 2:
The patent performs preliminary actions by forming wiring seed layers and applying adhesive material before placing the light emitting elements. The resist pattern is formed in advance to define the plating areas, enabling subsequent plating operations to successfully establish electrical connections without requiring light transmission through the substrate.
2Temperature
If a non-transparent substrate is used, then thermal conductivity is improved, but the conventional light irradiation method for curing adhesive material cannot be applied
Solution Approach 1:
The patent introduces a resist pattern as an intermediary element that defines the plating areas. This resist pattern serves as a mask during the plating process, enabling precise electrical connections to be established without requiring light transmission through the substrate, thus simplifying the overall manufacturing process.
Solution Approach 2:
The patent replaces the optical curing method (which requires light transmission) with a plating-based electrical connection method. Instead of using light irradiation to cure adhesive material and establish connections, the invention uses electroplating or electroless plating to form conductive paths, substituting an optical process with an electrochemical process that is compatible with non-transparent substrates.
3Ease of manufacture
If light irradiation is used to cure adhesive material on a transparent substrate, then mounting is achieved, but this method cannot be applied to non-transparent substrates required for high thermal conductivity
Solution Approach 1:
The patent changes the fundamental parameter of connection establishment from optical (light-induced curing) to electrochemical (plating). By changing the mechanism from photopolymerization to electroplating or electroless plating, the process becomes compatible with non-transparent substrates while maintaining the ability to achieve reliable electrical and thermal connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the light emitting element to be successfully mounted on both transparent and non-transparent substrates, enhancing thermal conductivity and integration capabilities while simplifying the manufacturing process by eliminating the need for light irradiation to cure adhesive materials.
Implementation Method 1
joining the first wiring seed layer with the p-side electrode disposed separately from the first wiring seed layer, and joining the second wiring seed layer with the n-side electrode disposed separately from the second wiring seed layer, by plating using the resist pattern as a mask
Data Source
AI summary
A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such that the p-side electrode and the first wiring seed layer are separated from and face each other, and the n-side electrode and the second wiring seed layer are separated from and face each other; joining the first wiring seed layer with the p-side electrode, and joining the second wiring seed layer with the n-side electrode, by plating using the resist pattern as a mask; and removing the resist pattern.