Light Source Module Thickness Reduction via Direct LED Mounting
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Solution Overview
Problem
Conventional light source modules have low luminous efficiency due to light loss from the P-type covering layer, conducting film, and electrodes, and their thickness is increased by the carrier plate and wires, making them unsuitable for small and lightweight electronic devices.
Innovation Solution
A light source module with a supporting base and protective glue, where the LED die is directly connected to the base without wire bonding, and the base is designed to reflect light beams, reducing thickness and enhancing luminous efficiency through uniform current distribution and microstructures to prevent total internal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional wire bonding process is used to connect LED die to circuit board, then electrical connection is established, but the overall thickness of the package structure is increased due to carrier plate and wire height
Solution Approach 1:
The patent removes the carrier plate from the packaging structure, extracting the element that causes increased thickness. The LED die is directly mounted on the circuit board without the intermediate carrier plate, eliminating the thickness contribution from both the carrier plate and the wires required for connection.
Solution Approach 2:
The patent merges the LED die directly with the circuit board by establishing electrical connection between the LED die and circuit board without intermediate components. This direct integration eliminates the need for separate carrier plate and wire bonding, reducing overall thickness while maintaining electrical functionality.
2Loss of energy
If light beam is outputted upwardly from multiple quantum well, then light generation is achieved, but luminous efficiency is reduced due to light loss from P-type covering layer, conducting film, and electrodes
Solution Approach 1:
The patent inverts the light output direction from upward to downward. The light beam is directed downward through the substrate instead of upward through the P-type covering layer and electrodes. This inversion allows light to exit through the substrate where there are fewer obstructive layers, significantly reducing light loss and improving luminous efficiency.
Solution Approach 2:
The patent modifies the substrate to have specific optical properties that enhance light extraction. The substrate is designed with microstructures or specific material characteristics that improve light output in the downward direction, creating local quality optimization at the light exit interface.
3Weight of moving object
If carrier plate and wires are used in package structure, then electrical connection is established, but the overall thickness is increased which is detrimental to small size and light weightiness
Solution Approach 1:
The patent extracts and removes the carrier plate and wire bonding components from the package structure. This elimination reduces the overall weight of the light source module while maintaining reliable electrical connection through direct mounting of the LED die on the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a 1.6-3 times increase in light-outputting efficiency and reduces the module's thickness, improving its slimness and heat dissipation, while maintaining high electrical properties and protecting the components.
Implementation Method 1
the base is designed to reflect light beams
Implementation Method 2
When a current is applied to a semiconductor material of Group III-V such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAs) or indium phosphide (InP), electrons recombine with holes. Consequently, the extra energy is released from a multiple quantum well (MQW) in the form of photons, and the light beam visible to the eyes is generated.
Implementation Method 3
a protective glue is formed on the light emitting diode die and the supporting base
Data Source
AI summary
A manufacturing method of a light source module includes the following steps. Firstly, a light emitting diode die is installed on a supporting base. Then, an electric connection between the light emitting diode die and the supporting base is established. Then, a protective glue is formed on the light emitting diode die and the supporting base. Afterwards, the supporting base is cut to produce the light source module. Since the supporting plate is not employed, the supporting plate removing process and the boning process of the conventional technology are omitted. Consequently, the manufacturing method of the present invention is effective to enhance the production quality of the light source module.