Discrete Conductor Pad Alignment for LED Package Soldering
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Solution Overview
Problem
The reliability and stability of electronic devices mounted on printed circuit boards (PCBs) are compromised due to uneven or misaligned bonding, which affects the electrical connections and overall performance of light emitting devices.
Innovation Solution
A light emitting device package design featuring discrete conductor pads and patterns on both the device and PCB, connected by solder, where at least two conductor patterns are electrically connected by the device, ensuring proper alignment and stability during soldering, and a lighting apparatus incorporating this package with a base and cover for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic devices are bonded to PCB by soldering, then electrical connections are established, but uneven or misaligned bonding occurs leading to reduced reliability and stability
Solution Approach 1:
The conductor patterns on the PCB are divided into multiple discrete segments (first conductor pattern, second conductor pattern, third conductor pattern, fourth conductor pattern) rather than continuous traces. This segmentation allows each pattern to be independently positioned and connected to corresponding conductor pads on the light emitting device, reducing the impact of misalignment on overall bonding reliability.
Solution Approach 2:
The conductor patterns are pre-formed on the PCB with predetermined positions and configurations before the light emitting device is mounted. This preliminary preparation ensures that when the device is bonded, the electrical connections are already optimized for reliability, and any misalignment can be compensated for by the discrete nature of the patterns rather than causing continuous connection failures.
2Manufacturing precision
If conductor patterns are discretely formed on PCB, then misalignment defects are reduced, but electrical connection paths become more complex
Solution Approach 1:
The electrical connection system is segmented into discrete conductor patterns and corresponding pads, where each pattern connects to its designated pad. This segmentation simplifies the alignment process during bonding while the overall complexity is managed through systematic arrangement of the segmented elements rather than continuous complex routing.
Solution Approach 2:
The discrete conductor patterns serve multiple functions: they provide electrical connections, enable alignment tolerance, and facilitate modular design. Each conductor pattern can be independently optimized for its specific connection requirement while contributing to the overall system functionality, reducing the need for additional alignment features or complex connection pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability and stability of light emitting device bonding to PCBs, ensuring consistent electrical connections and enhanced performance by maximizing the overlapping area between solder pads and electrode pads during the soldering process, reducing misalignment defects and enhancing light emission distribution.
Implementation Method 1
the first to fourth conductor patterns are connected to respective first to fourth conductor pads by respective first to fourth solders
Data Source
AI summary
Alight emitting device package may include a printed circuit board and a plurality of light emitting devices mounted on the printed circuit board, wherein a first light emitting device of the plurality of light emitting devices may comprise first to fourth conductor pads formed discretely on the bottom surface of the light emitting device, the printed circuit board comprises first to fourth conductor patterns formed discretely on the top surface of the printed circuit board, and the first to fourth conductor patterns are connected to respective first to fourth conductor pads by respective first to fourth solders.