LED Display Blocking Wall Prevents Pad Short Circuits

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Solution Overview

Problem

In the manufacturing of miniaturized light-emitting diode displays, the close proximity of pads on micro light-emitting diodes often leads to short circuits due to capillary action during the bonding process with a substrate, which is challenging to prevent effectively.

Innovation Solution

Incorporating a blocking wall on the substrate between the first and second pads of the light-emitting diode, with specific height and width constraints, to prevent contact between the pads and thus avoid short circuits, while maintaining electrical connectivity through separate electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the distance between two adjacent pads on micro light-emitting diode is reduced for miniaturization, then the size of light-emitting diode is reduced, but the pads are frequently caused to be connected due to capillary action during bonding process

Engineering Contradiction:
Improvesize of light-emitting diodeVSAvoidbonding reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

A blocking wall is introduced as an intermediary structure between the first pad and the second pad on the light-emitting diode. This blocking wall physically separates the two pads during the bonding process, preventing capillary action from causing pad connection. The blocking wall serves as a mediator that allows miniaturization to proceed while maintaining bonding reliability by blocking the harmful capillary flow path.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a blocking wall is added between the pads to prevent connection, then the bonding reliability is improved, but the device structure becomes more complex

Engineering Contradiction:
Improvebonding reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The blocking wall is designed with localized dimensions (height H2 and width W2) that are specifically optimized for the bonding process. The blocking wall's height is set to H2≤1⁄2H1 (where H1 is the maximum thickness of the semiconductor stack) and width is set to W2≤W1 (where W1 is the horizontal distance between electrodes). This localized, dimensionally-controlled approach provides the necessary protection against pad connection while minimizing the added structural complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of a blocking wall between the pads enhances the reliability of light-emitting diode displays by preventing unwanted connections, thereby reducing the occurrence of short circuits and improving the bonding process for miniaturized components.

Implementation Method 1

the two pads are frequently caused to be connected for reasons such as an overly close distance between the two adjacent pads on the micro light-emitting diode and a phenomenon of capillary action

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS11362244B2Light-emitting diode display
Publication Date: 2022.06.14 AU OPTRONICS CORP
  • US11362244B2 patent drawing
  • US11362244B2 patent drawing
  • US11362244B2 patent drawing

AI summary

A light-emitting diode display having sub-pixel regions is provided. Each of the sub-pixel region includes a substrate, first and second electrodes, a light-emitting diode, and at least one blocking wall. The substrate has an active device. The first and second electrodes are separately disposed on the substrate. The first electrode is electrically connected to the active device, and a horizontal distance between the first and second electrodes is W1. The light-emitting diode is disposed on the substrate and includes a semiconductor stack, and first and second pads. The first pad contacts the first electrode, the second pad contacts the second electrode, and a maximum thickness of the semiconductor stack is H1. The blocking wall is disposed on the substrate and located between the first and second pads to prevent a contact therebetween. A height of the blocking wall is H2 and a width thereof is W2. H2≤½H1, and W2≤W1.