LED Display Bump Structure for Short-Circuit Prevention
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Solution Overview
Problem
The miniaturization of display devices has led to narrower distances between light emitting diode pixels, increasing the likelihood of short-circuits between LEDs and bumps, and reducing the fluidity of non-conducting materials, thereby complicating the manufacturing process and reducing yield.
Innovation Solution
A light emitting diode display device design that incorporates a display board with unit pixels and a drive circuit board connected by bumps, where the bumps are arranged to reduce the likelihood of short-circuits and enhance the fluidity of non-conducting materials, using solder and filler materials like tin, silver, copper, and nickel to facilitate bonding and improve manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between pixels including light emitting diodes is narrowed to achieve miniaturization, then the display device size is reduced, but the possibility of short-circuit between light emitting diodes and bumps increases
Solution Approach 1:
The patent introduces a multi-layer bump structure (first bump, second bump, third bump at different heights) to create vertical dimensionality in the bonding connection. This three-dimensional arrangement allows bumps to be positioned at different elevations, enabling effective electrical connection while maintaining increased horizontal spacing between pixel elements, thus preventing short-circuits in miniaturized displays
Solution Approach 2:
The bonding structure is segmented into multiple distinct bump components (first bump, second bump, third bump) rather than using a single unified bump. This segmentation allows each bump to serve specific functions at different heights, creating a stepped configuration that prevents direct contact between adjacent pixel electrodes while maintaining reliable electrical connections
2Volume of moving object
If the distance between pixels including light emitting diodes is narrowed, then the display device is miniaturized, but the fluidity of non-conducting material for filling gaps is reduced
Solution Approach 1:
The stepped bump structure creates vertical cavities and gaps between bumps at different heights, providing three-dimensional spaces for non-conducting material to flow into. This vertical dimensionality allows filling material to access and occupy spaces that would be difficult to reach in a planar two-dimensional configuration, improving material distribution and void elimination
Solution Approach 2:
The bumps are pre-formed with specific height differences before the non-conducting material filling process. This preliminary structuring creates predetermined flow paths and cavities that guide the filling material, ensuring complete and uniform filling of gaps between pixels without requiring excessive material or complex filling procedures
3Ease of operation
If light emitting diode chips are separately cut to manufacture display devices, then individual pixel control is achieved, but the manufacturing time is increased
Solution Approach 1:
The patent combines multiple pixel elements and their associated bumps into a single integrated light emitting diode chip structure. This merging allows multiple pixels to be manufactured and tested together as one unit, eliminating the need for separate cutting and individual handling of each pixel chip, thereby significantly reducing manufacturing time while maintaining independent pixel control capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the possibility of short-circuits, increases the fluidity of non-conducting materials, and simplifies the manufacturing process, thereby improving the yield and reducing the time required for producing the display device.
Implementation Method 1
the first solder includes at least one of tin and silver, and wherein the first filler includes one of copper and nickel
Implementation Method 2
a first bump which is in contact with the first P electrode... a first solder being in direct contact with the first pad and a first filler disposed on the first solder, the first filler being in direct contact with the first P electrode
Data Source
AI summary
A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.