LED Display Chip Integration via Direct Substrate Formation
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Solution Overview
Problem
The manufacturing process of light emitting diode displays faces low yield due to the complexity of transferring light emitting diodes onto a drive circuit substrate, particularly with the need for precise alignment and the removal of substrates like sapphire, which affects the efficiency of the process.
Innovation Solution
The method involves forming light emitting diode chips with a first substrate, insulation layers, and switch devices, where the insulation layers have contact holes for electrical connection, and conductive patterns on the substrate, allowing the light emitting diodes to be integrated without direct transfer onto a drive circuit substrate, thereby enhancing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mass transfer method is used to transfer light emitting diodes onto the drive circuit substrate, then the light emitting diodes can be transferred using a flexible transferring head, but the process requires multiple picking up and disposing actions and precise alignment, which reduces manufacturing yield and efficiency
Solution Approach 1:
The patent merges the light emitting diode chip with the drive circuit substrate by directly forming the LED chip on the substrate using a single semiconductor layer structure. This eliminates the separate transfer process involving flexible transferring heads, multiple picking/disposing actions, and precise alignment requirements, thereby improving manufacturing yield and productivity.
Solution Approach 2:
The patent extracts the need for a separate transfer process by directly forming the light emitting diode chip on the drive circuit substrate. By removing the intermediate transfer step using flexible transferring heads, the invention eliminates the associated alignment precision requirements and multiple operations, thus improving manufacturing efficiency and yield.
2Device complexity
If the wafer transfer method is used to transfer the wafer and light emitting diodes onto the drive circuit substrate together, then the transfer process is simplified, but the wafer must be removed after electrical connection, which reduces manufacturing yield
Solution Approach 1:
The patent extracts and eliminates the wafer substrate from the process by directly forming the light emitting diode chip on the drive circuit substrate without using a separate wafer. This removes the need to transfer the wafer and subsequently remove it after electrical connection, thereby improving manufacturing yield while maintaining process simplicity.
Solution Approach 2:
The patent merges the light emitting diode chip formation process with the drive circuit substrate by directly forming the LED structure on the substrate. This eliminates the separate wafer transfer and removal steps, simplifying the overall process and improving manufacturing yield.
3Manufacturing precision
If precise alignment is required between the flexible transferring head and the drive circuit substrate during light emitting diode transfer, then the transfer can be completed, but the alignment requirement reduces manufacturing yield
Solution Approach 1:
The patent extracts and eliminates the flexible transferring head from the process by directly forming the light emitting diode chip on the drive circuit substrate. This removes the alignment precision requirement between the transferring head and substrate, thereby improving manufacturing yield without sacrificing transfer accuracy.
Data Source
AI summary
A light emitting diode display including at least one light emitting diode chip is provided. The light emitting diode chip includes a first substrate, a plurality of light emitting diodes, a first insulation layer and a plurality of switch devices. The plurality of light emitting diodes are disposed on the first substrate. The first insulation layer covers the plurality of light emitting diodes. The plurality of switch devices are disposed on the first insulation layer and electrically connected to the plurality of light emitting diodes. Moreover, a fabricating method of the light emitting diode display is also provided.