LED Display Common Electrode Integration
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Solution Overview
Problem
The process of growing and transferring micro light emitting diodes (LEDs) to display substrates is prone to defects and errors, particularly in connecting electrodes, which complicates the manufacturing of LED display apparatus and increases costs due to the high cost of semiconductor substrates and the inefficiency of the transfer process.
Innovation Solution
The LED display apparatus integrates micro light emitting diodes with a common electrode layer, allowing for simplified transfer and reduced connection errors by using a common electrode layer made of the same material as the semiconductor layer, thereby minimizing the number of connecting electrodes and stabilizing the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro light emitting diodes are grown on a separate semiconductor substrate and then transferred to the display substrate, then the light emitting devices can be manufactured with high precision, but the transfer process introduces defects and connection errors
Solution Approach 1:
The patent merges the common electrode layer and the semiconductor layer into a single integrated structure. The common electrode layer is formed as part of the semiconductor substrate itself, eliminating the need for separate transfer processes and reducing connection errors between layers.
Solution Approach 2:
The common electrode layer is formed in advance during the semiconductor substrate fabrication process, before the LED structures are grown. This preliminary formation of the electrode layer eliminates subsequent connection steps and potential defects.
2Ease of manufacture
If a separate transfer process is used to move LEDs from semiconductor substrate to display substrate, then the manufacturing process can be modularized, but the process complexity and defect rate increase
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. The common electrode layer formation, semiconductor growth, and LED fabrication are performed in sequence on the same substrate, eliminating the need for separate transfer operations and reducing overall process complexity.
3Reliability
If multiple connecting electrodes are used to connect the semiconductor layer to the common electrode layer, then the electrical connection can be ensured, but the number of process steps and potential defect points increase
Solution Approach 1:
The patent merges the common electrode layer and semiconductor layer into an integrated structure where the common electrode layer is formed within the semiconductor substrate. This eliminates the need for multiple separate connecting electrodes and reduces potential defect points while maintaining reliable electrical connections.
Solution Approach 2:
The common electrode layer is made of the same material as the semiconductor layer, creating a homogeneous structure that simplifies the interface between layers and reduces the need for additional connecting elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces process defects and improves reliability by simplifying the transfer and connection processes, leading to more efficient and cost-effective manufacturing of LED display apparatus.
Implementation Method 1
When the current is supplied, electrons are generated from the n-type semiconductor layer and the holes are generated from the p-type semiconductor layer, and then the electrons and the holes are combined in the active layer to emit light.
Data Source
AI summary
An LED display apparatus with a simplified manufacturing process is provided. The LED display apparatus includes a common electrode layer on a first substrate, a second substrate including a first pixel driving device and a second pixel driving device, and a first light emitting device and a second light emitting device on the common electrode layer. The first light emitting device includes a first n-type semiconductor layer, a first active layer, and a first p-type semiconductor layer. The second light emitting device includes a second n-type semiconductor layer, a second active layer, and a second p-type semiconductor layer. As such, it is possible to provide an LED display apparatus with improved manufacturing reliability having at least one unit pixel composed of pixels by using at least one light emitting device integrated with the common electrode layer and at least two individual light emitting devices.