LED Display Device with Concave Passivation for Bonding

The patent applies preliminary action by pre-forming concave portions in the passivation layer before mounting the light emitting devices. This preliminary structural preparation enables direct bonding without subsequent heating or cooling processes, thereby eliminating the time-consuming thermal cycles while maintaining bonding reliability through the precisely positioned concave structures that facilitate accurate alignment and stable electrical connection.

The patent replaces the thermal bonding system (heating/cooling processes) with a mechanical positioning system. The concave portions act as mechanical fixtures that physically constrain and precisely position the light emitting devices during bonding, substituting the need for thermal energy input with a mechanically driven alignment and bonding approach that achieves reliable connections without extended thermal processing time.

The concave portions are pre-formed in the passivation layer to create predetermined positioning features. These features serve as mechanical guides that constrain the light emitting devices during mounting, ensuring precise alignment without the thermal deformation that occurs in conventional heating-based bonding processes. The preliminary structural preparation eliminates alignment errors caused by thermal expansion and contraction.

The patent replaces thermal alignment methods with mechanical alignment using the concave portions. Instead of relying on thermal fields and hoping for minimal deformation, the invention uses physically formed concave structures that mechanically guide and precisely position the light emitting devices, achieving superior alignment precision through direct mechanical constraint rather than thermal control.

The concave portions are pre-formed in the passivation layer as part of the substrate preparation process. This preliminary action creates built-in positioning and bonding features that simplify the subsequent mounting process. Instead of requiring multiple heating and cooling steps, the pre-formed concave structures enable direct bonding operations, reducing process complexity while maintaining connection reliability through the mechanically stable concave geometries.

The patent replaces the complex thermal process system (multiple heating and cooling cycles) with a simplified mechanical bonding system. The concave portions provide mechanical guidance and constraint during bonding, eliminating the need for complex thermal management equipment and multi-step thermal processing, thereby reducing overall process complexity while achieving reliable connections through mechanical stability.