LED Display Insulating Layer Layout for Contact Hole Isolation

The patent transitions from conventional planar (2D) insulating layers to a three-dimensional stepped structure with multiple levels. The first, second, and third insulating layers are formed at different heights, creating a stepped configuration that allows contact holes to be filled more effectively and prevents short-circuits by providing better electrical isolation between conductive elements at different levels.

The insulating layer structure is segmented into multiple distinct layers (first, second, and third insulating layers) with different functions and heights. Each layer serves a specific purpose in the contact hole structure, with the first insulating layer providing base insulation, the second insulating layer forming the stepped surface, and the third insulating layer completing the filling and isolation. This segmentation allows for more precise control of electrical connections and reduced short-circuit risk.

By forming insulating layers at different heights (stepped structure), the patent creates a three-dimensional configuration that prevents short-circuits in the contact hole region. This dimensional change ensures proper electrical isolation, which maintains the reflectance properties of the underlying reflective layers by preventing current leakage that would otherwise cause short-circuits and reduce reflectance.

The patent uses a third insulating layer that completely fills the contact hole and extends to the top surface, creating a robust, permanent insulating barrier. This layer acts as a definitive solution to prevent short-circuits, ensuring long-term reliability and maintaining reflectance by permanently isolating conductive elements rather than relying on temporary or partial measures.

The patent forms the first, second, and third insulating layers in a predetermined sequence before finalizing the contact hole structure. The first insulating layer is formed initially, followed by the second insulating layer that creates the stepped surface, and finally the third insulating layer that completes the filling. This preliminary sequencing of layer formation simplifies the manufacturing process by establishing a clear, step-by-step fabrication roadmap that reduces complexity.

The insulating layers are nested within each other in a hierarchical structure, with the first insulating layer at the base, the second insulating layer forming the stepped surface, and the third insulating layer completing the outer structure. This nested configuration allows each layer to be formed and integrated systematically, simplifying the overall manufacturing process while achieving the desired stepped structure for short-circuit prevention.