Semiconductor LED Display Transfer With Anisotropic Contact Control
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Solution Overview
Problem
The existing transfer methods using an anisotropic conductive layer for semiconductor light emitting devices result in poor contact between the devices and the wiring electrode, especially when the area of the wiring substrate increases, leading to contact defects.
Innovation Solution
A display device structure and manufacturing method involving a substrate with wiring electrodes, semiconductor light emitting devices, and an anisotropic conductive layer made of conductive particles and insulating material, where the devices are alternately disposed and surrounded by different conductive layers, minimizing the flow of conductive particles during pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an anisotropic conductive layer is used to transfer semiconductor light emitting devices, then electrical connection between devices and wiring electrodes is achieved through thermal compression, but poor contact occurs when the wiring substrate area increases
Solution Approach 1:
The patent divides the transfer process into multiple sequential steps: first transferring devices to a temporary substrate, then to the final wiring substrate. This segmentation allows each transfer step to operate on a manageable scale, ensuring reliable contact even when the final substrate area is large. The temporary substrate acts as an intermediate platform that facilitates controlled transfer without the constraints of large-area direct transfer.
Solution Approach 2:
The patent introduces a temporary substrate as an intermediary element in the transfer process. This temporary substrate serves as a mediator between the device array and the final wiring substrate, enabling precise positioning and reliable electrical contact through the anisotropic conductive layer before final mounting. The intermediary substrate resolves the contact reliability issue by providing a controlled interface for electrical connection.
2Productivity
If semiconductor light emitting devices are transferred directly to a wiring substrate, then transfer efficiency improves, but contact defects occur due to poor contact between devices and wiring electrodes
Solution Approach 1:
The transfer process is segmented into two distinct phases: first, high-efficiency en masse transfer to a temporary substrate; second, controlled transfer to the final wiring substrate. This segmentation maintains high productivity by enabling batch transfer while ensuring contact quality through the controlled second transfer step where the anisotropic conductive layer establishes reliable electrical connections.
Solution Approach 2:
The patent performs preliminary transfer of devices to a temporary substrate before final mounting. This preliminary action allows for efficient batch transfer while preparing the devices for subsequent reliable electrical connection. The temporary substrate serves as a preparation platform that enables both high transfer efficiency and subsequent contact quality.
3Adaptability or versatility
If multiple semiconductor light emitting devices emitting different colors are transferred to a single wiring substrate, then device integration improves, but interference between devices occurs
Solution Approach 1:
The patent segments the transfer process by device type, transferring different colored semiconductor light emitting devices in separate batches to the temporary substrate, then to the final wiring substrate. This segmentation prevents interference during transfer by handling device types separately, while still achieving high integration on the final substrate. The temporary substrate acts as a sorting platform that eliminates cross-contamination during transfer.
Solution Approach 2:
The temporary substrate serves as an intermediary platform that enables safe co-transfer of multiple device types. By using this intermediate platform, devices emitting different colors can be positioned and oriented correctly without interfering with each other during the transfer process, while still achieving high integration on the final wiring substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contact defects between semiconductor light emitting devices and wiring electrodes by maintaining a consistent pressure and distance, allowing for the transfer of different colored devices without interference.
Implementation Method 1
an anisotropic conductive layer disposed between the semiconductor light emitting devices and formed of a mixture of conductive particles and an insulating material
Implementation Method 2
the semiconductor light emitting device and the wiring electrode can be electrically connected only by thermal compression
Data Source
AI summary
Discussed is a display device and a method for manufacturing the display device, where the display device includes a substrate, a wiring electrode disposed on the substrate, semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and includes conductive particles and an insulating material, and a light-transmitting layer formed between the semiconductor light emitting devices, where the semiconductor light emitting devices includes first semiconductor light emitting devices emitting a first color and second semiconductor light emitting devices emitting a second color different from the first color, and where the first and second semiconductor light emitting devices are alternately disposed with each other.