LED Display De-Mura Layout for High-Resolution Color Uniformity

The patent applies local quality by creating a de-mura region with a specific overlapping structure where LED chips from different wafer regions are arranged in an interlaced pattern. This local structural modification ensures that the transition zone between different chip arrays has mixed light emission properties, thereby improving color uniformity in the critical boundary region while maintaining overall mass transfer productivity.

The patent addresses the mura effect by introducing a spatial dimension solution through the overlapping region structure. Instead of modifying individual chip properties, it creates a two-dimensional interlaced arrangement where chips from different wafer regions overlap in a patterned fashion. This dimensional approach allows light mixing across the boundary, effectively suppressing the mura effect in high-resolution displays where individual chip variations are more visible.

The patent extracts the color uniformity function from the electronic control domain and implements it through a passive optical structure. By creating the overlapping de-mura region with interlaced chip arrangement, the system achieves color mixing and uniformity through physical light superposition rather than active electronic calibration. This extraction of the color correction function from complex control circuits to a simple structural design significantly reduces device complexity while maintaining color accuracy.