LED Display IC with Ceramic Thermal Compensation
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Solution Overview
Problem
Existing LED-based displays using electrolytic capacitances in buck power supplies have shorter lifespans than LEDs due to differences in packaging processes and component longevity, leading to inefficient power supply integration and reduced display life.
Innovation Solution
Integration of un-encapsulated LEDs and silicon-based components of the buck power supply into a single IC package using a ceramic layer to compensate for thermal expansion differences, along with non-electrolytic capacitances and a metal core layer for improved heat dissipation and packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrolytic capacitances are used in buck power supplies for LED-based displays, then the power supply can be integrated, but the lifespan of the display is reduced due to the shorter lifespan of electrolytic capacitances compared to LEDs
Solution Approach 1:
The patent replaces long-lived components (LEDs with 50,000+ hour lifespan) with shorter-lived but easier-to-integrate components (electrolytic capacitances). This allows the power supply to be manufactured as an integrated unit with the LEDs, even though the capacitances will need replacement sooner. The principle accepts component obsolescence to achieve manufacturing simplicity and integration benefits.
Solution Approach 2:
The patent segments the power supply components (capacitances, inductances, control circuits) from the main LED array, allowing them to be integrated into a separate IC package. This segmentation enables the power supply to be manufactured and tested independently, then combined with the LEDs, resolving the contradiction between integration ease and component lifespan matching.
2Reliability
If different packaging processes are used for LEDs and power supply components, then each component can be optimized for its specific requirements, but the integration efficiency is reduced
Solution Approach 1:
The patent merges the power supply components (capacitances, inductances, control circuits) with the LEDs into a single IC package. This combining allows both components to benefit from their respective optimized packaging processes while achieving physical integration. The power supply IC and LED array are packaged together in one housing, resolving the contradiction between component optimization and integration efficiency.
Solution Approach 2:
The IC package serves multiple functions: it houses both the LED array and the buck power supply components, providing both light emission and power management in a single integrated unit. This multi-functionality allows the package to accommodate different component types (LEDs and electronic components) with different packaging requirements, achieving both optimization and integration.
3Area of stationary object
If un-encapsulated LEDs are used in the IC package, then the integration density is increased, but the protection and heat management requirements are enhanced
Solution Approach 1:
The patent nests un-encapsulated LEDs within the IC package structure, placing them in close proximity to the power supply components without individual encapsulation. This nesting arrangement increases integration density by eliminating redundant encapsulation layers, while the IC package itself provides the necessary protection and thermal management infrastructure for the exposed LED surfaces.
Solution Approach 2:
The IC package serves as an intermediary structure that protects un-encapsulated LEDs from environmental harm while maintaining their exposed state for high-density integration. The package provides thermal pathways, mechanical support, and environmental sealing, allowing LEDs to remain un-encapsulated (for density) while still being protected (from harm).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach extends the life of LED-based displays by using non-electrolytic capacitances and a single packaging process, enhancing the integration of passive components and heat management, thereby improving the overall reliability and efficiency of the power supply.
Implementation Method 1
a ceramic layer to compensate for differences in thermal expansion
Implementation Method 2
a metal core layer for improved heat dissipation
Data Source
AI summary
An integrated circuit including a die of the integrated circuit, the die including an insulating layer, light emitting diodes, a semiconductor layer, and a control module. The insulating layer includes a first side and a second side. The second side is opposite to the first side. The light emitting diodes are arranged on the first side of the insulating layer. The semiconductor layer is arranged adjacent to the second side of the insulating layer. The light emitting diodes are connected to the semiconductor layer using connections from the first side of the insulating layer to the second side of the insulating layer. The control module is arranged on the semiconductor layer. The control module is configured to output pulse width modulated pulses to the light emitting diodes via the connections.