LED Display Insulating Layers Buffer Bonding Stress
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Solution Overview
Problem
The challenge in fabricating light emitting diode (LED) display apparatuses lies in the mismatch of thermal expansion coefficients during bonding, which affects the yield and device characteristics due to the stress generated during the bonding process of LEDs to substrates.
Innovation Solution
A protective insulating layer structure is implemented, where a first insulating layer is disposed on the periphery of the bump and the LED, contacting the bump and the substrate, and a second insulating layer surrounds at least a portion of the first insulating layer, buffering the forces and providing support and protection to the LED during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light emitting diodes are bonded directly to substrates without protective insulating layers, then the bonding process is simpler, but stress from thermal expansion coefficient mismatch affects yield and device characteristics
Solution Approach 1:
The patent introduces a first insulating layer as an intermediary between the bump and the light emitting diode, and a second insulating layer as an intermediary between the substrate and the first insulating layer. These intermediary layers buffer the stress generated during bonding due to thermal expansion coefficient mismatch, thereby improving device yield and characteristics while maintaining a manageable bonding process
Solution Approach 2:
The patent applies beforehand cushioning by forming protective insulating layers (first and second insulating layers) prior to the bonding process. These layers are specifically designed to cushion and absorb the stress that will be generated during bonding due to thermal expansion coefficient differences, preventing damage to the light emitting diode and improving device reliability
2Reliability
If protective insulating layers are added during LED bonding, then device yield and characteristics improve, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the protective insulating structure into two distinct layers: a first insulating layer positioned between the bump and the light emitting diode, and a second insulating layer positioned between the substrate and the first insulating layer. This segmentation allows each layer to perform its specific stress-buffering function independently, improving device reliability while keeping the manufacturing process organized and manageable through clear functional division
3Device complexity
If no insulating layers are used, then the structure is simpler, but stress during bonding affects device characteristics and yield
Solution Approach 1:
The patent introduces insulating layers as intermediary elements that mediate between the bump/substrate and the light emitting diode. These intermediary layers specifically protect the device characteristics and improve yield by buffering bonding stress, while maintaining a relatively simple overall structure through the use of standard thin film deposition techniques
Data Source
AI summary
A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.