LED Display Unit With Lateral Bonding Pad Matrix
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing hollow LED screens face challenges in achieving high light permeability while maintaining high pixel resolution, as the bonding pads on the circuit board obstruct light, reducing the screen's permeability.
Innovation Solution
The display unit features a bonding pad matrix on a lateral surface of the circuit board, with a V-shaped groove and equally spaced bonding pads on both the upper and lower halves, allowing LED lights to be surface-mounted without blocking light, and an automated production method that includes drilling, metallizing, and reflow soldering for efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bonding pads are disposed on the upper surface of the circuit board, then LED lights can be easily mounted, but light permeability is reduced due to obstruction by bonding pads and LED lights
Solution Approach 1:
The bonding pad matrix is relocated from the upper surface (2D plane) to the lateral surface (vertical dimension) of the circuit board. This dimensional transition allows LED lights to be mounted on the lateral surface, eliminating their obstruction of light passing through the upper surface, thereby resolving the contradiction between ease of mounting and light permeability.
Solution Approach 2:
The bonding pads are segmented into a matrix structure with multiple rows and columns on the lateral surface, allowing systematic organization of electrical connections while maintaining open spaces between individual bonding pads. This segmentation enables both easy mounting of LED lights on specific bonding pads and sufficient light permeability through the gaps in the matrix structure.
2Manufacturing precision
If pixel pitch is reduced to increase pixel resolution, then display quality is improved, but light permeability deteriorates due to higher aperture ratio requirements
Solution Approach 1:
By moving the bonding pad matrix to the lateral surface, the patent enables high pixel resolution on the upper surface without the obstruction of bonding pads and LED lights. This dimensional relocation allows the aperture ratio to be optimized for light permeability while maintaining high pixel resolution, as the bonding infrastructure no longer competes for space on the light-passing surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures high light permeability and efficient production, enabling high pixel resolution without obstructing light, and allows for automatic mass production with improved production efficiency and reduced labor costs.
Implementation Method 1
the driving IC is arranged on the circuit board and electrically connected to bonding pads of the bonding pad matrix, and pins of the LED light are welded to the bonding pads of the bonding pad matrix
Implementation Method 2
an LED light, a bonding pad matrix is provided on a first lateral surface of the circuit board, the driving IC is arranged on the circuit board and electrically connected to bonding pads of the bonding pad matrix
Data Source
Figure 1~3
Figure 4~6
Figure 7~9A
AI summary
An LED screen display unit and production method therefor. The LED screen display unit comprises a circuit board (1), a driving IC (2) and LEDs (3); a first face of said circuit board (1) is provided with a contact pad matrix (41); the driving IC (2) is arranged on the circuit board (1) and is in electrical connection with contact pads (4) of said contact pad matrix (41); the pins (31) of the LEDs (3) are soldered to contact pads (4) of the contact pad matrix (41). The present display unit can ensure a higher permeability rate for LED display screens produced having high pixel density.