LED Display Panel Non-Fixed Pitch Mass Transfer
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Solution Overview
Problem
Traditional package-on-board (POB) technology for LED display screens faces challenges with increased manufacturing costs and complex production processes due to the use of die-bonders and high-precision surface mount technology (SMT) for producing small-pitch N-in-one packages, leading to lower productivity and higher substrate costs.
Innovation Solution
The implementation of a light-emitting diode display panel with non-fixed pitches, where the pitch between light-emitting units in the same region is shorter than between units in adjacent regions, utilizing mass transfer technology to produce small-pitch N-in-1 packages, which enhances production efficiency and area utilization on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional POB technology uses die-bonder or high-precision SMT equipment to produce small-pitch N-in-one packages, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent segments the production process into two distinct stages: first producing packages with larger pitches using conventional equipment, then using a transfer device to reposition and arrange these packages into final small-pitch configurations on the substrate. This segmentation allows each stage to use appropriate equipment for its specific requirements, avoiding the need for high-precision equipment throughout the entire process.
Solution Approach 2:
The patent performs preliminary package formation with relaxed pitch requirements before the final substrate mounting stage. By pre-assembling the N-in-one packages with larger pitches using conventional die-bonder or SMT equipment, the system prepares components that can later be precisely arranged through the transfer device, thereby simplifying the overall manufacturing process while achieving the required final precision.
2Manufacturing precision
If traditional POB technology uses die-bonder or high-precision SMT equipment to produce small-pitch N-in-one packages, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The production process is divided into independent stages: bulk package production using high-speed conventional equipment, followed by a transfer and arrangement stage. This segmentation allows the majority of packages to be produced efficiently in batch mode, while only the necessary repositioning operations require precise control, thereby maintaining high overall productivity.
Solution Approach 2:
The transfer device creates a new arrangement pattern by picking and placing pre-formed packages onto the substrate in a different configuration than their original assembly. This copying approach allows the system to achieve small-pitch layouts without requiring the original assembly process to operate at the corresponding precision level, thus maintaining productivity.
3Device complexity
If traditional POB technology uses general die-bonder for die-transfer process, then device complexity is reduced, but productivity decreases and manufacturing cost increases
Solution Approach 1:
The patent separates the low-precision package assembly function from the high-precision substrate mounting function. Conventional die-bonder equipment handles the simpler task of initial package formation, while a specialized transfer device handles the precise placement on substrate. This segmentation allows each device to be optimized for its specific function, improving productivity without requiring all equipment to be complex.
Solution Approach 2:
The transfer device acts as an intermediary between the conventional package production line and the substrate mounting process. It receives pre-formed packages from the simple die-bonder and delivers them to the substrate with the required precision, thereby bridging the gap between equipment simplicity and production efficiency.
4Ease of manufacture
If larger package substrate area is used, then ease of manufacture is improved, but manufacturing cost increases
Solution Approach 1:
The patent employs a dynamic transfer and arrangement process that allows flexible optimization of package density and spacing on the substrate. By using the transfer device to precisely position packages, the system can achieve higher area utilization efficiency compared to fixed conventional mounting methods, thereby reducing the total substrate area required while maintaining ease of manufacture through the modular transfer approach.
Data Source
AI summary
A light-emitting diode display panel includes a driving substrate, and a first light-emitting region and a second light-emitting region disposed on the driving substrate. The first light-emitting region has a first region and a second region adjacent to the first region in the first direction. The second light-emitting region is adjacent to the first light-emitting region and has a first corresponding region. The second region is between the first region and the first corresponding region. The light-emitting diode display panel further includes pixels disposed in the first region, the second region, and the first corresponding region. Each pixel includes a first light-emitting unit. The first pitch is between the first light-emitting units in the first region and in the second region. The second pitch is between the first light-emitting units in the second region and the first corresponding region. The first pitch is shorter than the second pitch.