LED Display Device With Oversized Power Supply Host Surfaces
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Solution Overview
Problem
Current micro-LED display technologies face challenges in the precise transfer and positioning of LEDs onto interconnection networks, requiring high precision and resulting in lengthy and complex processes due to the small size of the LEDs and their connections.
Innovation Solution
A display device architecture is proposed where the power supply pads of LED modules are connected to larger conductive elements, allowing for non-deterministic or pseudo-random positioning of LED modules on a host surface with a significant ratio of host surface to connection surface, reducing the need for precise alignment and enabling flexible association of display elements and signal processing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise transfer and positioning of micro-LEDs onto interconnection networks is implemented, then connection reliability is improved, but manufacturing complexity and time increase significantly
Solution Approach 1:
The patent divides the connection interface into two distinct parts: small connection surfaces on LED modules and large host surfaces on conductive elements. This segmentation allows the LED modules to maintain their compact size while providing adequate connection areas, reducing the complexity of precise positioning without compromising connection reliability.
Solution Approach 2:
The patent introduces large host surfaces as intermediary elements between the LED modules and the interconnection network. These host surfaces act as mediators that receive LED modules with smaller connection surfaces, providing a buffer zone that reduces the precision requirements for positioning while ensuring reliable electrical connections.
2Manufacturing precision
If precise alignment of LED modules with conductive elements is required, then connection accuracy is improved, but manufacturing speed decreases
Solution Approach 1:
The patent segments the alignment requirement into two levels: precise alignment is only needed for the small connection surfaces of LED modules with their corresponding large host surfaces, while the overall positioning tolerance is significantly increased. This segmentation enables faster manufacturing processes without sacrificing connection accuracy.
Solution Approach 2:
The patent changes the dimensional parameters of the connection interface by making the host surfaces much larger than the connection surfaces. This parameter change transforms the alignment problem from requiring sub-micron precision to allowing much larger tolerances, thereby increasing manufacturing speed while maintaining connection accuracy.
3Area of moving object
If small connection surfaces are used on micro-LEDs, then device size is reduced, but positioning tolerance decreases
Solution Approach 1:
The patent segments the surface area into two functional zones: small connection surfaces for maintaining compact LED module size and large host surfaces for providing adequate positioning tolerance. This segmentation allows the LED modules to remain small while the host surfaces provide the necessary alignment margin.
Solution Approach 2:
The patent resolves the contradiction by transitioning to a different dimensional arrangement where the large host surfaces extend in dimensions perpendicular to the connection direction. This dimensional change allows small connection surfaces to be accommodated on compact LEDs while providing large alignment margins in other dimensions.
4Manufacturing precision
If deterministic positioning of LED modules is implemented, then connection precision is improved, but process complexity increases
Solution Approach 1:
The patent applies partial precision by providing excessive connection surface area on the host elements compared to the connection surfaces on LED modules. This excessive action ensures that even with non-deterministic positioning, adequate overlap and connection precision are achieved without requiring complex deterministic positioning processes.
Data Source
AI summary
A display device includes a support and first and second conductive electrical power supply elements, the first conductive element being arranged on the support. The display device also includes LED modules, each including at least one LED and two electrical power supply pads that are arranged on two opposite faces, respectively, of the LED module, one of which corresponds to an emissive face of the LED. The electrical power supply pads of each LED module are connected to the first and second conductive electrical power supply elements, respectively, and the connection area of an electrical power supply pad of an LED module for connection with the first conductive electrical power supply element is smaller than a receiving area of the first conductive element corresponding to the area of the first conductive element in a parallel plane to the connection areas of the power supply pads of the LED modules.