LED Display Unit Group Pin Integration for Welding
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Solution Overview
Problem
Conventional LED display units face difficulties in welding operations due to small size, leading to sealing issues and weak bonding between the encapsulating material and the substrate, resulting in poor sealing performance and moisture resistance.
Innovation Solution
An LED display unit group is designed with a pixel unit array comprising n rows and m columns of LED chips, where A-electrodes and B-electrodes are connected to common pins, increasing the number of pins and encapsulating material volume, facilitating reliable welding and improved sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of LED light-emitting units is reduced to achieve downsizing, then the display screen can be made smaller, but the welding operation becomes difficult and sealing performance deteriorates
Solution Approach 1:
The patent combines multiple independent LED light-emitting units into a single integrated display unit group. Instead of welding separate pins of individual units, the integrated structure provides a unified set of pins that can be welded as a group, significantly improving welding operability while maintaining the downsized display screen capability
2Volume of moving object
If the size of LED light-emitting units is reduced, then the display screen can be downsized, but the unit is easy to be sealing-off and not favorable to transportation
Solution Approach 1:
Multiple LED light-emitting units are merged into an integrated display unit group with a unified encapsulating material and substrate structure. This integration creates a larger, more robust sealing structure that is less prone to sealing failures and provides better protection during transportation
3Volume of moving object
If the volume of encapsulating material in the light-emitting unit is small, then the unit size can be reduced, but the bonding force between encapsulating material and insulating substrate becomes weak
Solution Approach 1:
The patent merges multiple units into an integrated structure where the total volume of encapsulating material is significantly increased. This larger volume provides sufficient bonding force between the encapsulating material and the insulating substrate, ensuring strong adhesion while maintaining a compact overall design
4Volume of moving object
If the volume of encapsulating material in the light-emitting unit is small, then the unit size can be reduced, but the sealing performance and moisture resistance become poor
Solution Approach 1:
By integrating multiple units into a single display unit group, the patent creates a larger encapsulating material volume that provides effective sealing. This integrated sealing structure prevents moisture ingress and protects the internal components, achieving reliable sealing performance while maintaining a compact form factor
5Reliability
If the number of pins in a single display unit is increased, then the number of welding points on PCB can be increased, but the device complexity increases
Solution Approach 1:
The patent combines multiple units into an integrated display unit group that provides a unified set of pins. This integration increases the number of welding points on the PCB in a organized manner, improving welding reliability without creating excessive complexity through systematic pin arrangement and unified circuit design
Data Source
AI summary
The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.