LED Display Substrate Removal and Bonding for Cross-Talk Elimination
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Solution Overview
Problem
The existing manufacturing methods for light-emitting diode (LED) displays face challenges in aligning bumps on electrodes for electrical connection and removing the growth substrate, which affects image quality due to cross-talk between pixels and increases production costs.
Innovation Solution
A bonding layer is formed between a driver substrate and an array of light-emitting diodes, allowing the growth substrate to be removed, and wavelength conversion elements are added to achieve full color display without cross-talk, using a bonding glue and connecting metals to support and electrically connect the driver carrier and LED array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bumps are formed on electrodes to electrically connect driver carrier and light-emitting diode array, then electrical connection is achieved, but alignment between bumps and electrodes becomes difficult and manufacturing complexity increases
Solution Approach 1:
The patent extracts and removes the growth substrate from the light-emitting diode structure after the LED array is formed. This extraction eliminates the substrate that causes optical interference and cross-talk between pixels, while maintaining the electrical connection functionality through the bonding layer and electrode structure.
Solution Approach 2:
The patent introduces a bonding layer as an intermediary component between the driver carrier and the light-emitting diode array. This bonding layer simplifies the electrical connection structure by providing a planar interface that facilitates easier alignment and connection between the driver electrodes and LED electrodes, eliminating the need for complex bump alignment.
2Strength
If growth substrate is retained to support light-emitting diode array, then structural support is provided, but cross-talk between neighboring pixels occurs and image quality deteriorates
Solution Approach 1:
The patent extracts and removes the growth substrate from the light-emitting diode structure after the LED array is formed. This extraction eliminates the substrate that causes optical interference and cross-talk between pixels, while maintaining the electrical connection functionality through the bonding layer and electrode structure.
Solution Approach 2:
The patent performs the substrate removal operation after the LED array is fully formed and electrically connected, but before the display module is assembled and operational. This timing ensures that the LED structure is stable and connected, while eliminating the harmful optical effects of the substrate in the final product.
3Reliability
If bonding layer is formed between driver substrate and light-emitting diode array, then structural support and electrical connection are achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple functions into the bonding layer: it provides structural support to hold the LED array, establishes electrical connections between driver and LED electrodes, and creates a planar interface for alignment. By combining these functions into a single layer, the overall device structure is simplified despite the additional manufacturing step.
Solution Approach 2:
The bonding layer serves multiple purposes simultaneously: mechanical support, electrical conduction, and alignment reference. This multi-functionality reduces the need for separate components for each function, simplifying the overall device architecture even though the bonding process itself is an additional step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the overall thickness of the display, increases flexibility, and enables mass production by eliminating cross-talk and supporting the driver carrier and LED array, while achieving full color through wavelength conversion.
Implementation Method 1
a plurality of wavelength conversion elements... The wavelength conversion elements and the light-emitting units are disposed at different sides of the semiconductor layer
Implementation Method 2
a bonding layer formed between the substrate and the array of light emitting diodes, and a plurality of wavelength conversion elements
Data Source
AI summary
A display includes a substrate with a plurality of electronic control elements, an array of light-emitting diodes having a semiconductor layer, a plurality of light emitting units disposed on the semiconductor layer, and a plurality of first electrodes disposed on the semiconductor layer, an bonding layer disposed between the substrate and the array of light-emitting diodes, and a plurality of wavelength conversion elements disposed on the semiconductor layer and spaced apart from each other. The plurality of wavelength conversion elements and the plurality of light emitting units are disposed at different sides of the semiconductor layer. The plurality of wavelength conversion elements is arranged in positions corresponding to the plurality of light-emitting units.