LED Display Virtual Area Driver IC Placement
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Solution Overview
Problem
The challenge is to densely pack the elements of a display device in portable devices, where space is limited, while ensuring the driver IC can be effectively integrated with light-emitting diode areas to maintain functionality.
Innovation Solution
A light-emitting diode display configuration featuring a substrate with wires, light-emitting areas, and a driver IC, where the driver IC is disposed on a virtual area corresponding to the light-emitting areas, allowing for tight packing and redundancy in case of diode damage, with a photosensitive resin black matrix and metal layers to enhance connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the driver IC is disposed on the virtual area corresponding to light-emitting areas, then the packing density is improved and pixel distance is reduced, but the device complexity increases due to the need for virtual area configuration and corresponding wiring
Solution Approach 1:
The display area is segmented into light-emitting areas and virtual areas, where virtual areas serve as dedicated zones for driver IC placement. This segmentation allows driver ICs to be positioned in non-light-emitting regions, increasing packing density without interfering with the light-emitting function.
Solution Approach 2:
The driver IC placement is moved from the traditional planar arrangement within the light-emitting area to a spatial arrangement utilizing the virtual area dimension. This dimensional reorganization allows driver ICs to be disposed in correspondence with light-emitting areas through the virtual area, reducing pixel distance while maintaining functional separation.
2Measurement precision
If light-emitting areas are packed more tightly to reduce pixel distance, then the display resolution is improved, but the reliability decreases due to reduced space for error tolerance and component placement
Solution Approach 1:
Virtual areas are pre-configured and reserved during the design stage as dedicated zones for driver IC placement. This preliminary action ensures that even when light-emitting areas are tightly packed to improve resolution, there is pre-allocated space available for reliable driver IC integration and error tolerance.
3Ease of manufacture
If the driver IC is formed directly on light-emitting areas, then the manufacturing process is simplified, but the light-emitting areas cannot be optimally positioned and pixel distance increases
Solution Approach 1:
The virtual area acts as an intermediary between the light-emitting areas and driver ICs. This intermediary structure allows driver ICs to be formed in correspondence with light-emitting areas without direct placement on them, maintaining manufacturing simplicity while enabling optimal positioning and reduced pixel distance through the mediating virtual area structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables closer packing of light-emitting areas, reduces pixel distance, and ensures display functionality by allowing a functioning diode to replace a damaged one, while protecting internal components from pollution and moisture.
Implementation Method 1
the plurality of wires, the first metal layer, and the second metal layer may increase thicknesses by an electroplating process, thus reducing impedance
Implementation Method 2
a photosensitive resin black matrix may be formed between the plurality of light-emitting areas
Implementation Method 3
a plurality of light-emitting areas may be small molecular organic light guiding layers or large molecular organic light guiding layers
Data Source
AI summary
A light-emitting diode display is provided. The light-emitting diode display includes a substrate, a plurality of wires, a plurality of light-emitting areas, and at least one driver IC. The plurality of wires are formed on the substrate. The plurality of light-emitting areas include a light-emitting diode area and a virtual area. The plurality of light-emitting areas are arranged in a matrix. The virtual area of the plurality of light-emitting areas corresponds to each other. The driver IC is formed on the virtual area of the plurality of the light-emitting areas or on the plurality of the light-emitting areas.