LED Package Dome-Shaped Filling Material for Thermal and Optical Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting device packages face challenges in increasing light emitting efficiency, reducing heat influence on phosphors, and achieving color uniformity, particularly in the manufacturing process and light distribution characteristics.
Innovation Solution
A light emitting device package design featuring a package body, lead frame, light emitting device, filling material with a dome-shaped surface, and a phosphor layer, where the filling material and phosphor layer are formed using a dispensing method to create a lens shape, reducing heat absorption and enhancing light emission and color uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If phosphors are coated directly on the LED chip to realize various colors, then color diversity is achieved, but light emitting efficiency changes and heat influence on phosphors increases
Solution Approach 1:
The patent introduces a filling material as an intermediary substance between the LED chip and phosphors. This filling material serves as a thermal barrier to reduce heat influence on phosphors while also acting as a medium to improve light extraction efficiency. The filling material is dispensed to form a dome-shaped structure that optimizes both thermal management and optical performance, resolving the contradiction between color diversity and light emitting efficiency.
2Illumination intensity
If a lens is added to increase light emitting efficiency and control light distribution, then optical performance improves, but device complexity increases
Solution Approach 1:
The patent merges the lens function with the filling material by dispensing the filling material to form a dome-shaped structure that simultaneously serves as both the filling medium and the lens. This integration eliminates the need for a separate lens component while maintaining light emitting efficiency and light distribution control, thus improving optical performance without increasing device complexity.
Solution Approach 2:
The filling material is designed to perform multiple functions: it fills the space around the LED chip, provides thermal management, enables phosphor attachment, and forms a lens structure for light control. This multi-functionality reduces the overall device complexity while achieving the desired optical performance.
3Ease of manufacture
If the filling material is coated flat on the LED chip, then manufacturing is simple, but light emission is absorbed and color uniformity is poor
Solution Approach 1:
The patent employs a dome-shaped curvature for the filling material instead of a flat coating. The dome shape is formed by dispensing the filling material in a controlled manner, allowing it to naturally form a curved surface. This curvature improves light extraction by reducing total internal reflection and enhancing light emission efficiency while maintaining manufacturing simplicity through the dispensing process.
4Use of energy by moving object
If phosphors are placed close to the LED chip for efficient light excitation, then light conversion efficiency improves, but heat damage to phosphors increases
Solution Approach 1:
The filling material acts as an intermediary layer between the LED chip and phosphors, enabling close proximity for efficient light excitation while simultaneously providing thermal isolation to protect phosphors from heat damage. The filling material's physical and thermal properties allow it to block heat transfer while permitting light transmission for phosphor excitation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light emitting efficiency without additional processes, reduces heat impact on phosphors, and improves color uniformity, allowing for effective light emission and increased brightness.
Implementation Method 1
a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material
Implementation Method 2
a phosphor layer comprising phosphors on the filling material
Data Source
AI summary
A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.