LED Illumination Means with Downstream Semiconductor Chip Groups

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Solution Overview

Problem

Existing light sources struggle to achieve homogeneous emission in terms of intensity and color, as they often result in uneven radiation patterns due to the arrangement of LED chips and lack efficient color mixing.

Innovation Solution

A light source comprising multiple groups of semiconductor chips emitting in different spectral ranges, where the radiation from the first and second groups is mixed with the third group to produce white light, with the third group's semiconductor chips being arranged downstream and optically coupled to ensure uniform emission, and an optical element is used for efficient color mixing and radiation distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple LED chips are arranged in different planes or positions, then the light source can achieve broader spectral coverage, but the emission homogeneity in terms of intensity and color deteriorates

Engineering Contradiction:
Improvespectral coverageVSAvoidemission homogeneity
Core Design Contradiction:
Adaptability or versatilityVSIllumination intensity

Solution Approach 1:

The patent transitions from lateral arrangement of LED chips to a vertical stacking configuration where chips are arranged in multiple planes along the optical axis. This dimensional change allows different wavelength ranges to be emitted from different vertical positions, enabling spectral diversity while maintaining emission homogeneity through the overlapping vertical projection of the chips.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where multiple LED chips are vertically stacked with each chip positioned above the previous one. The chips are arranged such that their vertical projections overlap, creating a compact nested configuration that achieves both spectral coverage and emission homogeneity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Device complexity

If LED chips are arranged laterally next to each other, then the device structure is simplified, but the color mixing efficiency and emission uniformity deteriorate

Engineering Contradiction:
Improvestructural simplicityVSAvoidcolor mixing efficiency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent moves from lateral (horizontal) arrangement to vertical stacking, utilizing the vertical dimension to achieve color mixing. This allows each chip to contribute to the overall emission from its specific vertical position, improving color mixing efficiency while maintaining a relatively simple device structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a light source with homogeneous mixed radiation in terms of intensity and color, ensuring efficient color mixing and uniform emission over a large area, with the ability to adjust the color locus and maintain mechanical flexibility.

Implementation Method 1

The semiconductor chips are designed to emit electromagnetic radiation, in particular in the visible spectral range, during operation

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

The light source has an optical element, in particular a planar optical element, which is optically arranged between the semiconductor chips of the first and second group and the semiconductor chips of the third group

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 3

The optical element mixes the radiation from the first and second groups with the radiation from the third group

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentEP2324501B1Illumination means comprising three groups of semiconductor chips
Publication Date: 2018.11.21 OSRAM OPTO SEMICON GMBH & CO OHG
  • EP2324501B1 patent drawingFigure 1~2
  • EP2324501B1 patent drawingFigure 3A~3B
  • EP2324501B1 patent drawingFigure 4~6

AI summary

In at least one embodiment of the illumination means (10), said means feature a first group (11) of semiconductor chips (1) and a second group (22) of semiconductor chips (2), wherein the groups (11, 22) each comprise at least one semiconductor chip (1, 2) and the first and the second group (11, 22) of semiconductor chips (1, 2) are arranged at least in part, laterally side by side with respect to a primary direction of radiation (H) of the illumination means (10).  Furthermore, the illumination means (10) comprise a third group (33) of semiconductor chips (3) which contains at least one semiconductor chip (3) and wherein the third group (33) is connected downstream of the first and second group (11, 22) with respect to the primary direction of radiation (H).  Each group (11, 22, 33) of semiconductor chips (1,,2 3) is designed to emit in pairs, mutually different wavelength ranges of electromagnetic radiation (L1, L2, L3), in particular in the visible spectral range.  The radiation (L3) emitted from the third group (33) of semiconductor chips (3) has the shortest wavelength range.  The radiation (L1, L2) emitted from the first and second group (11, 22) of semiconductor chips (1, 2) moves at least in part into at least one semiconductor chip (3) of the third group (33).  A mixed radiation (M) is emitted via one emission surface (4) of the illumination means (10).