Integrated LED Driver Fabrication Without Silicon Interposers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high packaging costs and complexity of integrating light-emitting diodes (LEDs) with their driver electronics, particularly due to the use of silicon interposers and through silicon vias (TSVs), which increase costs and hinder efficient integration and performance.
Innovation Solution
A method of fabricating integrated LED and LED driver units by forming the LED driver on a semiconductor substrate with bond pads and directly coupling the LED to these pads, eliminating the need for silicon interposers and TSVs, thereby reducing packaging costs and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon interposers and through silicon vias (TSVs) are used to connect LED driver to LED, then electrical connection is achieved, but packaging costs increase and device complexity increases
Solution Approach 1:
The patent extracts and eliminates the silicon interposer and TSV components from the traditional packaging structure. Instead of using complex through-silicon via technology, the invention directly bonds the LED chip to the PCB substrate through simplified conductive pathways, removing unnecessary intermediate layers and reducing overall packaging complexity while maintaining reliable electrical connection.
Solution Approach 2:
The invention merges the LED chip mounting function with the electrical connection function into a single integrated packaging structure. By combining what were previously separate functions (mechanical support via interposer and electrical connection via TSV) into a unified direct bonding approach, the patent reduces device complexity and packaging costs while achieving both structural and electrical integration.
2Reliability
If silicon interposers are used for LED packaging, then electrical connection is provided, but package costs increase beyond semiconductor LED cost
Solution Approach 1:
The patent replaces expensive silicon interposer materials with more cost-effective alternative materials that can achieve the same electrical connection function. The invention uses standard PCB substrates and conventional bonding techniques instead of costly silicon-based interposer technology, significantly reducing packaging costs to remain competitive with semiconductor LED costs while maintaining reliable electrical connectivity.
Solution Approach 2:
The invention changes the material parameters and structural parameters of the packaging system. Instead of using high-cost silicon interposers with complex TSV structures, the patent adopts cost-effective PCB substrates with simplified conductive pathways, altering the cost parameter while preserving the essential electrical connection function.
3Ease of manufacture
If direct coupling of LED to bond pad is implemented, then packaging costs are reduced and integration is simplified, but connection distance must be minimized to reduce parasitic effects
Solution Approach 1:
The patent segments the electrical connection path into minimized sections by placing bond pads in immediate proximity to LED chip contact points. This segmentation approach breaks down the connection path into the shortest possible segments, reducing cumulative parasitic effects while maintaining the benefits of direct coupling and simplified integration.
Solution Approach 2:
The invention optimizes the spatial arrangement of bond pads and LED contact points by utilizing three-dimensional positioning strategies. By carefully controlling the vertical and lateral dimensions of the connection path, the patent minimizes the length of conductive pathways, thereby reducing parasitic capacitance, resistance, and inductance while maintaining cost-effective direct coupling.
Data Source
AI summary
Integrated LED and LED driver units and methods for fabricating integrated LED and LED driver units and products with a plurality of integrated LED and LED driver units are provided. In an embodiment, a method for fabricating an integrated LED and LED driver includes forming an LED driver in a first substrate, wherein the first substrate is a semiconductor substrate. The method include forming a bond pad over a top surface of the semiconductor substrate and electrically connected to the LED driver. Also, the method includes forming an LED on a second substrate. Further, the method includes directly coupling the LED to the bond pad.