LED Light Emitting Device With Dual-Layer Conductive Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current light emitting diodes (LEDs) face challenges in achieving high heat-radiation efficiency and enhanced physical properties such as strength and electrical conductivity, which are crucial for their performance in various applications including displays, vehicle lighting, and lighting systems.
Innovation Solution
The implementation of a light emitting device structure that includes a conductive support member with a second conductive support member having higher thermal conductivity than the first, which is formed under the light emitting structure, utilizing carbon-based materials like carbon nano tubes and composite materials to enhance heat-radiation efficiency and physical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional single-layer support member is used under the LED structure, then the device complexity is low, but the heat-radiation efficiency is insufficient
Solution Approach 1:
The support member is divided into multiple layers with different materials and functions. The first support member provides mechanical support and electrical connection, while the second support member specialized in heat dissipation is positioned adjacent to the LED chip. This segmentation allows each layer to optimize its specific function, resolving the contradiction between structural simplicity and heat-radiation efficiency.
Solution Approach 2:
The patent employs composite material construction where the first support member may include metal materials for electrical conductivity and mechanical strength, while the second support member uses materials with high thermal conductivity specifically for heat dissipation. This composite approach enables the support structure to simultaneously achieve mechanical support, electrical connection, and superior heat-radiation efficiency without excessive complexity.
2Volume of moving object
If the LED chip size is reduced to improve integration, then the device can be more compact, but the heat-radiation efficiency decreases
Solution Approach 1:
The support structure is designed with local quality optimization where the second support member is positioned specifically adjacent to the LED chip to maximize heat dissipation at the heat-generating region. This localized heat management approach allows the LED chip to be miniaturized for better integration while maintaining effective heat-radiation efficiency through the strategically positioned high thermal conductivity support member.
3Power
If high-power LED applications are implemented, then the luminance and efficiency are improved, but the heat generation increases requiring better heat management
Solution Approach 1:
The second support member acts as an intermediary heat transfer component between the LED chip and the first support member or substrate. This intermediary structure with high thermal conductivity facilitates efficient heat transfer from the high-power LED chip, enabling high luminance and efficiency applications while managing the increased heat generation through the mediating heat dissipation pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for superior heat-radiation efficiency, increased strength, and improved electrical conductivity, enabling the use of LEDs in high-power applications with reduced thickness and improved reliability.
Implementation Method 1
The second conductive support member has a thermal conductivity higher than that of the first conductive support member
Data Source
AI summary
Provided is a light emitting device. The light emitting device comprises: In one embodiment, a light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member.