LED Lighting Apparatus with Dual Optic Elements and Segmented PCB
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Solution Overview
Problem
The manufacture and assembly of LED light engines that convert light colors are labor-intensive and prone to damage, with phosphor-based LEDs experiencing efficiency losses due to heat and Stokes shift, and existing automation methods are not commercially viable.
Innovation Solution
The use of a printed circuit board with a segmented conductor pathway for electrical and thermal management, combined with a card edge connector for easy installation and removal, and a dual-optic element structure where the second optic element is separate from the LED chip to reduce heat impact, allowing for efficient light conversion and easy color customization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If phosphor is mixed with polymer to provide volumetric blue light conversion, then white light emission is achieved, but efficiency is reduced due to Stokes shift heat loss
Solution Approach 1:
The patent divides the light conversion function into separate components: a planar phosphor layer deposited on the LED chip surface, rather than mixing phosphor throughout the polymer volume. This segmentation allows the phosphor to convert light at a defined interface, reducing the path length for photons and minimizing energy loss through multiple scattering events and Stokes shift.
Solution Approach 2:
The patent introduces a reflective layer as an intermediary between the LED chip and the phosphor layer, and between the phosphor layer and the external environment. This reflective layer redirects photons that would otherwise be lost, improving overall light extraction efficiency and reducing the need for excessive phosphor conversion that would increase Stokes shift losses.
2Productivity
If phosphor is placed close to LED chip for efficient light conversion, then color conversion is improved, but package degradation occurs due to heat from LED chip and Stokes shift
Solution Approach 1:
The patent applies local quality by creating a specialized thermal management zone around the LED chip. The heat sink structure includes localized thermal vias and conductive pathways directly beneath the chip, concentrating cooling capacity where heat generation is highest, while the phosphor layer is positioned to receive optimal light conversion without excessive thermal exposure.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional thermal management by incorporating vertical thermal vias and layered heat sink structures. This dimensional approach allows heat to be conducted away from the chip-phosphor interface in multiple directions, reducing localized temperature buildup that would cause package degradation while maintaining close proximity for efficient light conversion.
3Adaptability or versatility
If each LED optic is separately attached to LED chip, then customization is possible, but assembly is labor-intensive and time-consuming
Solution Approach 1:
The patent creates a universal LED module platform with standardized chip mounting, phosphor deposition, and heat sink attachment procedures. This universal base design allows different phosphor formulations and optic configurations to be implemented through simple material changes rather than complete reassembly, enabling color customization while maintaining high assembly throughput through standardized manufacturing processes.
4Productivity
If robot or pick-and-place equipment is used for LED optic attachment, then assembly time is decreased, but commercial viability is still not achieved
Solution Approach 1:
The patent merges the LED chip mounting, phosphor application, and optic attachment operations into a single integrated manufacturing step. By designing the phosphor layer and optic as co-formed components that are applied simultaneously to the chip assembly, the patent eliminates the need for separate robotic positioning and attachment operations, achieving both high productivity and commercial viability through process consolidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and speeds up the manufacturing and installation of LED lighting systems, enhances efficiency by lateral heat transfer, and allows for easy color adjustment without damaging the LEDs, improving both manufacturing efficiency and light output.
Implementation Method 1
A phosphor (for example, a YAG:Ce phosphor) that converts the blue light from the LED chip having a first wavelength range to yellow light having a second wavelength range
Implementation Method 2
An LED chip and may be configured to emit light of a color other than a color emitted by the LED chip
Implementation Method 3
The printed circuit board includes a segmented conductor pathway configured to electrically couple at least a portion of the array of LED chips
Data Source
AI summary
A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.